Introduction to the PCB Immersion Deposition Tin

The Immersion Deposition Tin process is a plating-free process for depositing tin on copper surfaces. It works by using copper and tin in an acid solution where the active tin is higher than copper, so that the pad copper foil reacts with the tin ions in the sink and the tin is oxidised and a unifor

The Solder Joint Void Caused by Electroplating Impurity

Voids are usually observed during reflow soldering, which is generally considered to be one of the reasons for weakening the thermal conductivity and mechanical strength of solder joints. When analyzing the cause of void formation, we can easily associate it with flux.

How to Select the Right Anisotropic Conductive Adhesive for Your Product?

When selecting anisotropic conductive adhesives (ACA) suitable for specific products, Fitech leverages technological innovation and industry expertise to deliver high-performance solutions for ultra-fine pitch connections, flexible electronics packaging, and high-frequency signal transmission.

Introduction to Package on Package (PoP) and Pad Printing

With the development of semiconductor-integrated technology, the electronic products in the current market, such as mobile phones, computers, and electronic watches, are small and portable, with excellent electrical performance and low prices. The development of packaging technology is one of the key factors to improve performance and reduce the pr

The Difference Between Anisotropic Conductive Adhesive and Isotropic Conductive Adhesive

Anisotropic conductive adhesives (ACA) and isotropic conductive adhesives (ICA) exhibit significant differences in terms of conductive direction, conductive particle concentration, application scenarios, preparation processes, and storage conditions.

Solving SMT Reflow Cracking: Advantages and Application Techniques of High-Temperature Solder Paste

High-temperature solder pastes (e.g., SAC305, SAC387) significantly enhance mechanical strength and creep resistance of solder joints in high-temperature environments by optimizing alloy composition—such as increasing silver content or adding elements like Bi, Sb, and Ni.

In the microcosm of Mini LED technology, how does solder paste make a significant impact?

In the micro-scale world of Mini LED technology, solder paste emerges as the critical material for overcoming miniaturization challenges through four core advantages: high-precision printing, ultra-fine particle filling, high thermal conductivity alloy formulations, and environmentally adaptive design.

What are the differences between liquid flux and paste flux?

Transparent or translucent liquid primarily composed of rosin, activators (such as organic acids or halides), solvents (e.g., alcohol, acetone), and antioxidants.