What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.

What is the Soldering drawbridge effect?

Welding drawbridge effect is a typical defect in SMT chip processing, need to optimise the design, process control and material selection comprehensive solution. Its name comes from the phenomenon resembles a drawbridge, but no direct correlation with the psychological "drawbridge effect", belongs to the engineering field of terminology.

What should I do if the solder paste does not adhere to the pads?

Solder paste not adhering to the pad is a common problem in electronic soldering, usually caused by oxidation, contamination, insufficient temperature or solder/flux problems. The following are the detailed troubleshooting and solutions:

Current Status of High-Lead Solder Use and Alternatives

In order to protect human health and safety and to improve the environmental performance of electronic equipment, the European Union adopted the Restriction of Hazardous Substances RoHS Directive in 2006, which prohibits the use of certain hazardous substances, including lead, in electronic equipment.

What are the key indicators for AEC-Q200 certification of automotive electronic solder pastes?

AEC-Q200 certification for automotive electronic solder pastes is a key standard to ensure that they meet the high reliability requirements of the automotive electronics industry. the AEC-Q200 certification covers a series of stringent test items, the following three dimensions from the core test items, test conditions and requirements, and the sig

Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering

Solder paste is a mixture of tin powder particles and flux paste. The flux in the solder paste has four static properties and four dynamic properties. The four dynamic properties of the industry is often referred to as flux to remove the oxide layer, prevent re oxidation, reduce the surface tension of liquid solder

What are the steps in the lead-free soldering process?

The core steps of the lead-free soldering process are listed below, each of which contains key control points to ensure solder quality: