Grape Ball Effect Causes the Effective Life of Solder Paste after Printing

Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.

The Difference Between SPI and AOI in SMT

In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system.

What environmental conditions need to be strictly adhered to in order to use laser solder paste?

The process application of laser solder paste needs to be based on environmental control as the cornerstone, through the construction of "temperature - humidity - cleanliness" trinity of precision management system, combined with dynamic parameter adjustment and process adaptation

What are the reasons for PCB pads not being tinned and vias not working?

In electronics manufacturing and PCB (Printed Circuit Board) production process, the pads do not tin and through-hole is a common process defects, may be caused by design, materials, process or environmental factors.

What type of solder paste is needed in the field of micro-optical displays?

In the field of micro-optical display (Mini LED, Micro LED and COB package), the choice of solder paste needs to synthesize the three core dimensions of chip size, encapsulation process and reliability requirements, the specific program is as follows:

Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.

Solder Paste Jetting Process Introduction

The jetting process is an emerging non-contact solder paste deposition technology that utilizes a high-speed jetting valve to spray tiny solder paste droplets onto the pads of printed circuit boards -PCBs to achieve on-demand, precise deposition of solder paste.

Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used