In the microcosm of Mini LED technology, how does solder paste make a significant impact?

In the micro-scale world of Mini LED technology, solder paste emerges as the critical material for overcoming miniaturization challenges through four core advantages: high-precision printing, ultra-fine particle filling, high thermal conductivity alloy formulations, and environmentally adaptive design.

What are the differences between liquid flux and paste flux?

Transparent or translucent liquid primarily composed of rosin, activators (such as organic acids or halides), solvents (e.g., alcohol, acetone), and antioxidants.

What alloys are generally required for military solder paste

he extreme operating environments of military electronics (e.g., high temperatures, high humidity, strong vibrations, huge temperature differences) place almost exacting demands on the materials used in their assembly - especially solder paste alloys.

How to Classify Lead-Free Solder Pastes and Achieve Lead-Free Soldering?

Definition：Lead-free solder paste has developed rapidly as an alternative to leaded solder paste. EU’s RoHS ISO9453 and Japan's JEIDA stipulate that solder alloys with Pb content less than 0.1wt% (1000ppm) can be defined as lead-free solder alloys.

An overview of how solder paste cools down chips?

By optimising the thermal conductivity of the material, strengthening the metallurgical connection structure and adapting the alloy design to different application scenarios, solder paste achieves efficient heat dissipation of the chip.

Gold Embrittlement in BGA Solder Joints

Gold embrittlement is a soldering defect that refers to solder joints that contain too much intermetallic compound (IMC), resulting in increased brittleness and reduced reliability.

Grape Ball Effect Causes the Effective Life of Solder Paste after Printing

Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.

The Difference Between SPI and AOI in SMT

In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system.