What Is Black Pad?

Copper is commonly used as the pad material in the packaging process. To avoid copper oxidation and improve the solderability of copper pads, various surface treatment methods are used to coat metal layers on copper pads. Common surface treatment processes include OSP, electroless nickel immersion gold (ENIG), etc.

The principle of anisotropic conductive adhesive in detail

Anisotropic Conductive Adhesive (Anisotropic Conductive Adhesive, ACA) is a special kind of conductive adhesive, its conductivity has a directional, that is, after hot pressing and curing in one direction (usually vertical) with good conductivity, while in another direction (such as the horizontal direction) is manifested as insulation.

μBGA, CSP in the Reflow Soldering of the Reasons for the High Rate of Cold Soldering

In the reflow soldering process, for μBGA and CSP packaged chips with dense feet (pitch ≤ 0.5mm), there is a risk of higher incidence of cold soldering due to the hidden nature of the soldering site and the difficulty of heat transfer to the solder ball solder joint site. Under the same peak temperature and reflow time conditions, the heat gain

The Introduction of IoT

When you start your day, the alarm goes off, and the coffee maker starts brewing. The lights come on as you walk through the house. Some invisible computing device responds to your voice commands, reads your schedule and news, and turns on TV news when you're ready. Your car will drive you to work through the least congested routes, allowing you to

What are the factors that affect solder paste activity?

Regularly test solder paste activity and avoid using expired or deteriorated solder paste.

How to solve the problem of dry solder paste?

For solder paste drying problem, you can start from storage, use, process, environment, material selection, emergency treatment and other aspects, the following provides you with systematic solutions:

How to make QFN solder climb height of 50% or more?

In order to make QFN soldering climb tin height of more than 50%, it is necessary to optimise the stencil design, solder paste selection, soldering environment control, pretreatment process in four aspects.The following are specific programmes and validation cases：

Detailed explanation of the solder paste process in the phenomenon of non-wetting

Through the synergistic optimisation of material, process and design, the non-wetting problem can be effectively controlled, thus improving the long-term reliability of solder joints.