An overview of how solder paste cools down chips?

By optimising the thermal conductivity of the material, strengthening the metallurgical connection structure and adapting the alloy design to different application scenarios, solder paste achieves efficient heat dissipation of the chip.

Gold Embrittlement in BGA Solder Joints

Gold embrittlement is a soldering defect that refers to solder joints that contain too much intermetallic compound (IMC), resulting in increased brittleness and reduced reliability.

Grape Ball Effect Causes the Effective Life of Solder Paste after Printing

Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.

The Difference Between SPI and AOI in SMT

In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system.

What environmental conditions need to be strictly adhered to in order to use laser solder paste?

The process application of laser solder paste needs to be based on environmental control as the cornerstone, through the construction of "temperature - humidity - cleanliness" trinity of precision management system, combined with dynamic parameter adjustment and process adaptation

What are the reasons for PCB pads not being tinned and vias not working?

In electronics manufacturing and PCB (Printed Circuit Board) production process, the pads do not tin and through-hole is a common process defects, may be caused by design, materials, process or environmental factors.

What type of solder paste is needed in the field of micro-optical displays?

In the field of micro-optical display (Mini LED, Micro LED and COB package), the choice of solder paste needs to synthesize the three core dimensions of chip size, encapsulation process and reliability requirements, the specific program is as follows:

Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.