Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.

Solder Paste Jetting Process Introduction

The jetting process is an emerging non-contact solder paste deposition technology that utilizes a high-speed jetting valve to spray tiny solder paste droplets onto the pads of printed circuit boards -PCBs to achieve on-demand, precise deposition of solder paste.

Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used

Impact of solder paste printing on the success rate of reflow soldering

According to statistics, in the PCB design is correct, components and printed board quality is guaranteed under the premise of surface assembly quality problems in nearly 70% is out of the solder paste printing process. Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform。

What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.

What is the Soldering drawbridge effect?

Welding drawbridge effect is a typical defect in SMT chip processing, need to optimise the design, process control and material selection comprehensive solution. Its name comes from the phenomenon resembles a drawbridge, but no direct correlation with the psychological "drawbridge effect", belongs to the engineering field of terminology.

What should I do if the solder paste does not adhere to the pads?

Solder paste not adhering to the pad is a common problem in electronic soldering, usually caused by oxidation, contamination, insufficient temperature or solder/flux problems. The following are the detailed troubleshooting and solutions: