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Industry News

Welcome to the Sz Fitech Solder News and Updates page.  Here you’ll find our latest press releases, company announcements, and essential industry news that shapes the modern solder landscape.

What are the key indicators for AEC-Q200 certification of automotive electronic solder pastes?

What are the key indicators for AEC-Q200 certification of automotive electronic solder pastes?

AEC-Q200 certification for automotive electronic solder pastes is a key standard to ensure that they meet the high reliability requirements of the automotive electronics industry. the AEC-Q200 certification covers a series of stringent test items, the following three dimensions from the core test items, test conditions and requirements, and the sig

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Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering

Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering

Solder paste is a mixture of tin powder particles and flux paste. The flux in the solder paste has four static properties and four dynamic properties. The four dynamic properties of the industry is often referred to as flux to remove the oxide layer, prevent re oxidation, reduce the surface tension of liquid solder

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What are the steps in the lead-free soldering process?

What are the steps in the lead-free soldering process?

The core steps of the lead-free soldering process are listed below, each of which contains key control points to ensure solder quality:

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Dynamic thermal deformation curves for commonly used BGA packages

Dynamic thermal deformation curves for commonly used BGA packages

Analysis of P-BGA and F-BGA thermal deformation process and stencil opening optimisation

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What are the requirements for solder paste in the aerospace sector?

What are the requirements for solder paste in the aerospace sector?

The technical requirements for solder pastes in the aerospace sector reflect the deep integration of cutting-edge materials science and engineering practice.The following is a systematic overview of the technical challenges, solutions and industry trends:

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Reliability of BGA solder joints under mechanical and thermal stresses

Reliability of BGA solder joints under mechanical and thermal stresses

BGA (Ball Grid Array Package) is a common integrated circuit packaging technology which has the advantages of large contact area and high signal transmission efficiency. However, BGA solder joints are located at the bottom of the device and are not easy to detect and maintain.

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What causes a lot of solder paste residue?

What causes a lot of solder paste residue?

The problem of solder paste residue is usually caused by a combination of process parameters, material properties, equipment condition and environmental control.The following combines industry practice and the latest research, common causes and solutions for systematic sorting and supplement:

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