Ultrasonic-Assisted Bonding in Si/Cu Solder Joint

Silicon is a common crystal material with a low coefficient of thermal expansion in modern microelectronics. It is widely used in advanced packaging fields such as power devices and 3D packaging. However, as the packaging density increases.

What fields are leaded solder pastes suitable for?

Lead-containing solder paste, with its low cost, excellent soldering performance, and adaptability, finds extensive application across various sectors including electronics manufacturing, metal processing, LED lighting, the automotive industry, communication equipment.

What should We Know about Solder Paste Wettability?

Solder paste is commonly used in the semiconductor packaging to connect chips and pads. Through printing, dispensing, and other processes, solder paste can become the connection medium between copper pads and chips.

The Effect of Metal Segregation on the Reliability of Welded Joints

Metal segregation is a common phenomenon in the welding process, which refers to the inhomogeneous chemical composition distribution in the metal alloy.

Why is tin with 97% purity considered pure tin?

In the field of metallic materials, the definition of "pure" often varies depending on the application scenario. For tin, the widespread acceptance of 97% purity as "pure tin" stems both from the industry's balancing act between performance and cost.

How to Select the Right Solder Paste for COB Packaging?

Selecting the right solder paste for COB packaging requires comprehensive consideration of chip size, packaging process, reliability requirements, and cost. As a specialized manufacturer in microelectronic packaging materials.

Introduction to the PCB Immersion Deposition Tin

The Immersion Deposition Tin process is a plating-free process for depositing tin on copper surfaces. It works by using copper and tin in an acid solution where the active tin is higher than copper, so that the pad copper foil reacts with the tin ions in the sink and the tin is oxidised and a unifor

The Solder Joint Void Caused by Electroplating Impurity

Voids are usually observed during reflow soldering, which is generally considered to be one of the reasons for weakening the thermal conductivity and mechanical strength of solder joints. When analyzing the cause of void formation, we can easily associate it with flux.