The Parameters Affecting Centrifugal Atomized Solder Powder

Semiconductor packaging processes such as SMT, BGA, solid crystal, etc. often use solder paste. Solder paste is composed of solder powder and flux. The highest proportion is solder powder.

Mechanism of P segregation at the weld interface  of ENIG Ni(P) coatings

P segregation is a phenomenon that occurs when metallurgical reactions between Ni and Sn in the solder lead to an enrichment of P in the Ni(P) layer near the weld interface when reflow soldering with ENIG Ni(P) layers.

Is Cleaning Necessary When Using  No-Clean Flux?

Flux is an indispensable substance in the soldering process, its role is to remove the oxides of the soldered parts, increase the wettability of the soldered joints, and improve the quality and reliability of soldering.

Introduction to FCCSP Flip Chip Packaging Process

As mobile, networking and consumer electronic devices are updated, electronics are becoming more and more functional and smaller in size, with ever-increasing performance requirements for semiconductor packages.

How to Avoid the Problem of Dropping Parts of the Second Reflow When Double-Sided Mounting?

Double-sided mounting process can improve the actual utilisation of PCB, reduce manufacturing costs, and meet the demand for miniaturisation and high integration of end products. However, the use of double-sided mounting, double-sided reflow process will bring the following problems.

Effect of solder paste viscosity on porosity and mechanical  properties of surface mount solder joints

Surface mount technology is one of the most important technologies in the electronics industry, where components are attached to a printed circuit board by means of solder paste.

Solder Paste for Mini LED Package

Mini LED is a new type of display technology that uses 50-200 micron LED chips as backlight or pixel units, achieving excellent display effects such as high brightness, high contrast and high colour gamut, etc.

A Brief Analysis of the Application of Laser Solder Paste in Electronic Interconnection

Laser solder paste, as an advanced soldering material, has demonstrated significant advantages and promising development potential in the field of electronic interconnection.