Current Status of High-Lead Solder Use and Alternatives

In order to protect human health and safety and to improve the environmental performance of electronic equipment, the European Union adopted the Restriction of Hazardous Substances RoHS Directive in 2006, which prohibits the use of certain hazardous substances, including lead, in electronic equipment.

What are the key indicators for AEC-Q200 certification of automotive electronic solder pastes?

AEC-Q200 certification for automotive electronic solder pastes is a key standard to ensure that they meet the high reliability requirements of the automotive electronics industry. the AEC-Q200 certification covers a series of stringent test items, the following three dimensions from the core test items, test conditions and requirements, and the sig

Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering

Solder paste is a mixture of tin powder particles and flux paste. The flux in the solder paste has four static properties and four dynamic properties. The four dynamic properties of the industry is often referred to as flux to remove the oxide layer, prevent re oxidation, reduce the surface tension of liquid solder

What are the steps in the lead-free soldering process?

The core steps of the lead-free soldering process are listed below, each of which contains key control points to ensure solder quality:

What is Kirkendall Hollow

Dynamic thermal deformation curves for commonly used BGA packages

Analysis of P-BGA and F-BGA thermal deformation process and stencil opening optimisation

What are the requirements for solder paste in the aerospace sector?

The technical requirements for solder pastes in the aerospace sector reflect the deep integration of cutting-edge materials science and engineering practice.The following is a systematic overview of the technical challenges, solutions and industry trends:

Reliability of BGA solder joints under mechanical and thermal stresses

BGA (Ball Grid Array Package) is a common integrated circuit packaging technology which has the advantages of large contact area and high signal transmission efficiency. However, BGA solder joints are located at the bottom of the device and are not easy to detect and maintain.