What is Kirkendall Hollow

Dynamic thermal deformation curves for commonly used BGA packages

Analysis of P-BGA and F-BGA thermal deformation process and stencil opening optimisation

What are the requirements for solder paste in the aerospace sector?

The technical requirements for solder pastes in the aerospace sector reflect the deep integration of cutting-edge materials science and engineering practice.The following is a systematic overview of the technical challenges, solutions and industry trends:

Reliability of BGA solder joints under mechanical and thermal stresses

BGA (Ball Grid Array Package) is a common integrated circuit packaging technology which has the advantages of large contact area and high signal transmission efficiency. However, BGA solder joints are located at the bottom of the device and are not easy to detect and maintain.

What causes a lot of solder paste residue?

The problem of solder paste residue is usually caused by a combination of process parameters, material properties, equipment condition and environmental control.The following combines industry practice and the latest research, common causes and solutions for systematic sorting and supplement:

How to clean the solder paste left in the solder paste bottle?

that combines physical and chemical methods and safe practices to ensure efficient, safe and environmentally friendly cleaning:

Detailed explanation of the causes of non-wetting open soldering and improvement measures

Non Wet Open (NWO) refers to the PCB (Printed Circuit Board), BGA (Ball Grid Array) pads do not achieve a good wet open solder joints.Typical characteristics of its slicing diagram for all or part of the PCB pads on the lack of solder wetting, as shown in Figure 1-1 (not attached here, but a clear description).

What Is Black Pad?

Copper is commonly used as the pad material in the packaging process. To avoid copper oxidation and improve the solderability of copper pads, various surface treatment methods are used to coat metal layers on copper pads. Common surface treatment processes include OSP, electroless nickel immersion gold (ENIG), etc.