What are the reasons for PCB pads not being tinned and vias not working?

In electronics manufacturing and PCB (Printed Circuit Board) production process, the pads do not tin and through-hole is a common process defects, may be caused by design, materials, process or environmental factors.

What type of solder paste is needed in the field of micro-optical displays?

In the field of micro-optical display (Mini LED, Micro LED and COB package), the choice of solder paste needs to synthesize the three core dimensions of chip size, encapsulation process and reliability requirements, the specific program is as follows:

Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.

Solder Paste Jetting Process Introduction

The jetting process is an emerging non-contact solder paste deposition technology that utilizes a high-speed jetting valve to spray tiny solder paste droplets onto the pads of printed circuit boards -PCBs to achieve on-demand, precise deposition of solder paste.

Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used

Impact of solder paste printing on the success rate of reflow soldering

According to statistics, in the PCB design is correct, components and printed board quality is guaranteed under the premise of surface assembly quality problems in nearly 70% is out of the solder paste printing process. Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform。

What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.