Epoxy Flux on POP Laminated Packages

For mobile devices such as mobile phones, area array packages such as BGAs, CSPs or POPs are prone to drop failures and need to be reinforced when they are assembled onto printed circuit boards. While underfill is an alternative solution, it increases manufacturing costs and reduces temperature cycling reliability due to the additional curing steps

Thermomigration of Solder Joints

What kind of lead-free solder paste should be selected for flip-chip packaging is a problem that needs to be comprehensively considered, including both process conditions and solder paste characteristics. The easiest way to choose a suitable lead-free solder paste for the flip chip is to contact us through the contact information below. Our enginee

Common Solder Defects and Root Cause Analysis

Voiding occurs in components such as BGA, SGA, QFN, and LGA and increase with a higher reflow temperatures and greater surface tension with lead free alloy. Voiding is affected by the ability of the flux chemistry to effectively (how quickly and how completely) remove surface oxides. As the solvent volatizes, the viscosity of the flux remnant incr

Brief Reflow Profiles Analysis

The rapid cooling phase will lead to a fine grain structure. The limiting factor for the maximum cooling rate is the stress that is exerted on the solder joint if the rate is too fast due to the different CTE of components involved. A cooling rate of ~4°C/second is normal.

What Kind of Solder Paste is Selected for Flip Chip Package?

What kind of lead-free solder paste should be selected for flip-chip packaging is a problem that needs to be comprehensively considered, including both process conditions and solder paste characteristics. The easiest way to choose a suitable lead-free solder paste for the flip chip is to contact us through the contact information below. Our enginee

Solder Paste for MEMS Package: Atomic Layer Deposition Process Assists PowderMEMS

Solder Paste and Ultra-Fine Solder Manufacturer-Shenzhen Fitech is a comprehensive solder paste supplier integrating production, sales, research, and service of solder paste, epoxy solder paste, and solder powder. Fitech is the leading unit for the formulation of solder powder standards of the Ministry of Industry and Information Technology. Fitech

How to improve solder paste printing yield?

In summary, to improve the yield of solder paste printing needs to consider the quality of solder paste, equipment and process optimisation, stencil and paste characteristics matching, environmental control, process monitoring and testing, as well as continuous improvement and innovation and other aspects.Through the implementation of these strateg

The phenomenon of tin not soldering onto the pad of a desoldered PCB.

Through the optimisation of tin sinking process, improve the solderability of the base metal, eliminate impurities and outgassing sources, the use of appropriate reflow gas and temperature profile and strengthen the quality control and process monitoring and other measures, can effectively solve the double-sided mounting PCBA in the second solderin