What solder paste do I need to solder a mobile phone motherboard?

Soldering mobile phone motherboards requires the selection of solder paste suitable for high-density, fine solder joints, and the following are key factors and recommendations:

Device failure due to SMT wick effect

The wick effect, also known as the creeping tin effect, is an inherent characteristic of solder in the PCB soldering mechanism: "solder always flows from low temperature to high temperature", which means that the nature of solder is to go where the temperature is high.

What are the brands of solder paste widely used in China at present?

The widely used solder paste brands in China include both internationally renowned brands and excellent local manufacturers.

The physical characteristics and application areas of tin powder

As an important metal powder material, tin powder, by virtue of its unique physicochemical properties, shows a wide range of application value in a number of industrial fields.The following is a detailed description from both physical characteristics and application areas:

Wave Soldering Solder Pull Tip is How to Form

Wave soldering, sometimes found at the top of the components and pins or solder joints with icicle or stalactite-like solder, this phenomenon is called pull tip, as shown in Figure.

What is the difference between solid crystal solder paste and red glue?

Solid crystal solder paste and red glue are two common materials in the field of electronic packaging, and they have significant differences in composition, function, process, performance and application.

Printing Solder Paste_ Electroforming Process for Stencil Manufacturing

Shenzhen Fitech can provide solder paste products for the printing process. Fitech’s printing solder paste has adjustable viscosity, guaranteeing excellent printability and solder release performance. The products can help customers eliminate their concerns about the unstable printing performance of solder paste. Welcome to inquire for more infor

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect