Tin whisker phenomenon in electronic packaging and its control strategy

Tin whiskers are elongated, needle-like single crystals of tin that form spontaneously on the surface of pure tin (Sn) or tin-containing alloys. These whiskers are usually only a few microns in diameter, but can be several millimetres or even more than 10 millimetres long, which can cause serious reliability problems. The following is a comprehensi

Which is better, flux or rosin?

Flux and rosin each have their own characteristics and advantages in the soldering process, the choice of which is better to use needs to be based on specific application scenarios to decide.

Wetting reactions of lead-free eutectic solders in the metallisation layer under thick Cu bumps

The wetting reaction of a lead-free eutectic solder to a metallised layer under a thick Cu bump involves a number of aspects, and the following is a detailed analysis of the process:

Difference between flux and solder paste

Fluxes and flux pastes both play an important role in the soldering process, but there are some distinct differences in their composition, use, form, and application scenarios.

What are the advantages of ultrafine tin powder?

Ultrafine tin powder is ultrafine solder powder with particle size model above T6 (5~15μm), including T6 (5~15μm), T7 (2~11μm), T8 (2~8μm), T9 (1~5μm), T10 (1~3μm) and other models of ultrafine tin powder. Ultra micro tin powder is the key material for microelectronics and semiconductor packaging, precision device packaging.

What is the difference between solder paste, solder wire and solder bar?

solder paste, tin wire and solder bar in the soldering process each has its own unique shape, composition and use, they play an irreplaceable role in their respective fields, with the development trend of electronic devices thin, light, short, refined, the application of solder paste is becoming more and more widespread.

The main factors affecting the printing of solder paste

cThe main influencing factors of solder paste printing can be summarised as follows

How to choose between low temperature solder paste, medium temperature solder paste and high temperature solder paste?

When choosing between low-temperature solder paste, medium-temperature solder paste and high-temperature solder paste, the main factors to be considered are the soldering temperature, the application scenario and the heat resistance of the components.