How to clean the solder paste left in the solder paste bottle?

that combines physical and chemical methods and safe practices to ensure efficient, safe and environmentally friendly cleaning:

Detailed explanation of the causes of non-wetting open soldering and improvement measures

Non Wet Open (NWO) refers to the PCB (Printed Circuit Board), BGA (Ball Grid Array) pads do not achieve a good wet open solder joints.Typical characteristics of its slicing diagram for all or part of the PCB pads on the lack of solder wetting, as shown in Figure 1-1 (not attached here, but a clear description).

What Is Black Pad?

Copper is commonly used as the pad material in the packaging process. To avoid copper oxidation and improve the solderability of copper pads, various surface treatment methods are used to coat metal layers on copper pads. Common surface treatment processes include OSP, electroless nickel immersion gold (ENIG), etc.

The principle of anisotropic conductive adhesive in detail

Anisotropic Conductive Adhesive (Anisotropic Conductive Adhesive, ACA) is a special kind of conductive adhesive, its conductivity has a directional, that is, after hot pressing and curing in one direction (usually vertical) with good conductivity, while in another direction (such as the horizontal direction) is manifested as insulation.

μBGA, CSP in the Reflow Soldering of the Reasons for the High Rate of Cold Soldering

In the reflow soldering process, for μBGA and CSP packaged chips with dense feet (pitch ≤ 0.5mm), there is a risk of higher incidence of cold soldering due to the hidden nature of the soldering site and the difficulty of heat transfer to the solder ball solder joint site. Under the same peak temperature and reflow time conditions, the heat gain

The Introduction of IoT

When you start your day, the alarm goes off, and the coffee maker starts brewing. The lights come on as you walk through the house. Some invisible computing device responds to your voice commands, reads your schedule and news, and turns on TV news when you're ready. Your car will drive you to work through the least congested routes, allowing you to

What are the factors that affect solder paste activity?

Regularly test solder paste activity and avoid using expired or deteriorated solder paste.

How to solve the problem of dry solder paste?

For solder paste drying problem, you can start from storage, use, process, environment, material selection, emergency treatment and other aspects, the following provides you with systematic solutions: