Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used

Impact of solder paste printing on the success rate of reflow soldering

According to statistics, in the PCB design is correct, components and printed board quality is guaranteed under the premise of surface assembly quality problems in nearly 70% is out of the solder paste printing process. Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform。

What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.

What is the Soldering drawbridge effect?

Welding drawbridge effect is a typical defect in SMT chip processing, need to optimise the design, process control and material selection comprehensive solution. Its name comes from the phenomenon resembles a drawbridge, but no direct correlation with the psychological "drawbridge effect", belongs to the engineering field of terminology.

What should I do if the solder paste does not adhere to the pads?

Solder paste not adhering to the pad is a common problem in electronic soldering, usually caused by oxidation, contamination, insufficient temperature or solder/flux problems. The following are the detailed troubleshooting and solutions:

Current Status of High-Lead Solder Use and Alternatives

In order to protect human health and safety and to improve the environmental performance of electronic equipment, the European Union adopted the Restriction of Hazardous Substances RoHS Directive in 2006, which prohibits the use of certain hazardous substances, including lead, in electronic equipment.

What are the key indicators for AEC-Q200 certification of automotive electronic solder pastes?

AEC-Q200 certification for automotive electronic solder pastes is a key standard to ensure that they meet the high reliability requirements of the automotive electronics industry. the AEC-Q200 certification covers a series of stringent test items, the following three dimensions from the core test items, test conditions and requirements, and the sig