How to Select the Right Anisotropic Conductive Adhesive for Your Product?

When selecting anisotropic conductive adhesives (ACA) suitable for specific products, Fitech leverages technological innovation and industry expertise to deliver high-performance solutions for ultra-fine pitch connections, flexible electronics packaging, and high-frequency signal transmission. Key advantages include:

I. Ultra-Fine Pitch Interconnects: Nanoscale Conductive Particles Push Boundaries

Fitech's proprietary sub-micron conductive particles (500-2000nm gold/silver-coated) enable reliable connections at pitches below 30μm, meeting high-density demands for advanced packaging (e.g., COF, SiP). Core innovations include:

Flat Design: Maximizes particle contact area with resistivity as low as 10⁻⁴ Ω·cm, significantly enhancing high-frequency signal (5G, RF) transmission efficiency.

Core-Shell Structure: Metal-coated polymer cores reduce density and improve dispersion, balancing cost and performance while optimizing conductive pathways.

II. Flexible Electronics Packaging: Low-Temperature Curing & Highly Flexible Matrix

Addressing flexibility and process compatibility requirements for flexible electronics (FPC, OLED displays), Fitech introduces low-temperature curing ACF (150-180°C) with advantages including:

Thermally Sensitive Material Compatibility: Prevents high-temperature damage to plastics and flexible substrates, ensuring component integrity.

Composite Matrix: Polyurethane/acrylic matrix combines high peel strength (≥15 N/m) with flexibility, withstanding repeated bending to extend product lifespan.

III. High-Frequency Signal Transmission: Low Resistance & Moisture/Heat Resistance

Fitech enhances ACA conductivity and reliability through material optimization:

Low resistivity: Resistivity controlled at 10⁻³–10⁻⁴ Ω·cm. Flat particles and core-shell structure reduce creep threshold, minimizing material usage.

Moisture/heat resistance: Utilizes low-moisture-absorption epoxy resin and gold-plated particles. Passes dual 85 tests (85°C/85% RH, 1000 hours) with resistance change rate <5%, meeting stringent automotive-grade requirements.

IV. Process Adaptability: Efficient Dispensing & Rapid Curing

Fitech ACA demonstrates high process stability and efficiency:

High thixotropy (>4): Supports spot/line dispensing for complex structural components.

Rapid curing: Press-to-cure time reduced to 4–6 seconds. Combined with low-temperature curing, it boosts production line efficiency and lowers energy consumption.

Precision Alignment: Achieves ±3μm alignment accuracy in LCD driver chip bonding, reducing conduction failure rates.

V. Application Coverage: Consumer Electronics and Automotive Electronics

Consumer Electronics

Flexible OLED Screens: Low-modulus substrate withstands repeated bending, offering superior resistance stability over traditional materials.

TWS Earbud Charging Cases: Ultra-fine pitch ACF enables miniaturized designs while ensuring charging efficiency.

Automotive Electronics

In-vehicle display COG bonding: Moisture-resistant ACA certified to AEC-Q100, withstands high-temperature/humidity environment degradation.

Battery Management System (BMS): High-reliability ACA ensures stable current transmission, reducing thermal runaway risk.

VI. Cost & Environmental Sustainability: Coating Optimization & Green Materials

Coating Design: Utilizes core-shell structures like gold/silver-copper-nickel-tin particles, balancing conductivity and cost for mid-to-low-end products.

Eco-Friendly Materials: Halogen-free flame retardants (phosphorus-based compounds) and bio-based resins (soybean epoxy) reduce petroleum dependency while complying with RoHS regulations.

VII. Supplier Advantages: Technical Independence and Customization Services

As a leading domestic microelectronics materials enterprise, Fitech's core competitiveness lies in:

Full-chain Technical Independence: Mastery of core technologies spanning conductive particle synthesis to matrix development.

Mass Production Stability: ACA products maintain storage stability exceeding 3 months with consistently reliable quality.

Customized Solutions: Tailored support through adjustment of conductive particle types, matrix materials, and curing conditions based on client requirements.