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Gold tin solder paste, Ultra-fine solder past...
10 +
T2-T10 All-Size Cases
20 +years
Industry Experience
20 +
Research Staff
40 +
Patents
WHO WE ARE
Fitech’s Ultra-Fine Solder Assists in Innovation
Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.
The company offers a comprehensive product line, ranging from alloy solder powders to ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range of ultra-fine alloy solders, from T2 to T10.
Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of alloy solder powders are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries.
Solder paste, as an important electronic soldering material, plays a vital role in the electronics manufacturing industry. Its main function is to provide high quality solder connections, reduce oxidation, provide wettability and conductive heat transfer. Fitech solder paste covers a wide range of models and specifications, including ultra-fine solder paste, Gold-tin solder paste, medium temperature solder paste SAC305, low temperature solder paste, high temperature solder paste, etc., which are suitable for different microelectronics and semiconductor packaging needs.
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Solder powder is a kind of connecting material used in electronic industry, which is mainly composed of Sn (tin) and other metals (such as Pb, Ag, Cu, etc.) as alloy powder. Fitech solder powder adopts Fitech's patented powder making technology - liquid phase molding spherical alloy powder technology, which applies the principle of ultrasonic cavitation effect, and can be used for the preparation of ultra-fine solder powder T6 (5~15μm)， T7(2~11μm)，T8 (2~8μm)，T9 (1~5μm)，T10 (1~3μm)，and has already been mass-produced on a large scale. This technology enables the solder powder to have excellent sphericity and low oxygen content, which ensur
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Flux is an important and indispensable material in the soldering process, with the main functions of removing oxides, preventing re-oxidation, reducing surface tension and increasing the soldering area.Fitech fine pitch flux is a flux material used in microelectronics and semiconductor production, assembly and packaging. It is suitable for high-precision and high-reliability packaging in the fields of wafer bump soldering, chip vaporization soldering, BGA, SiP, CSP, MicroLED packaging.
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Our Professional Team is Here to Help
Our team is filled with seasoned experts who can’t wait to help you find the right solution for your business.
Contact Us NowDue to its high-quality and high-tech production and development, Fitech's products are used in various applications, including microelectronic packages and power device packages, such as simple 3C products, electronic packages in automobiles, IoT and wearable devices, medical devices, military and aerospace, LED packages, rail transportation and 5G...
FITECH's partners are all over the world, involving microelectronics, semiconductors, automotive, medical, military and other industries; We have a mature product line and can also assist our customers to make specific welding solutions for their specific projects. We work with customers to make progress and develop together....
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Microstructure and mechanical properties of solder joints
There is a strong link between the microstructure and the mechanical properties of the solder joints, such as the cooling rate, creep and fatigue properties, as well as the lead-free alloy properties have a large impact on the solder joint properties. The following are some analyses and further explanations:
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Dec, 2024
The Impacts of Laser and Reflow Soldering on Solder Joints
With the advent of the "post-Moore era", heterogeneous integration based on small chips will become the mainstream of semiconductor packaging. Small chips tend to be packaged in 3D directions to achieve flexible modular integration and system-on-chip integration. It should be considered that 3D packaging will bring some problems. For example, high-
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Nov, 2024
Corrosion Effecst of Salt Spray on SAC305 Solder
Electronic products are used in a variety of environments, which requires them to have good reliability in different environments. The reliability of electronic products is reflected in the solder joints. Solder joints with low reliability are easily weakened by temperature, humidity, stress, and other factors, eventually leading to damage to elect
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Nov, 2024
High-Temperature solder on Flip Chips and Low-Temperature Solder Paste on Laminate Substrates
Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, realizing the interconnection with more than 10,000 I/Os and a pitch of less than 200um, realizing the transition from ceramic substrates to low-cost organic substrates, and achieving th
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Nov, 2024
The Evolution of Intermetallic Compounds during Laser Soldering
With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration. Laser soldering has become popular for improving soldering processes with its unique advantages of non-contact, selective local heating, and high precision. What we know is that la
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Nov, 2024
Detailed explanation of the solder paste process in the dropped pieces and solder ball problem
In the electronic assembly process, dropped parts and solder balls are common quality problems, they have a direct impact on the reliability and performance of the product.
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Nov, 2024
Alexander
I have been using this, the solder paste does not dry out in winter, the quality is particularly stable Recommended purchase.The seller's service is also very good, customs clearance is fast, and the speed of delivery is unbeatable. The price is also real, worthy of cooperation and trust!
David
Real manufacturers direct sales, product quality is no excuse, with SGS and other well-known institutions of the test report, the user can rest assured that the use of both environmental protection and safety.
Andrew
It is understood that Fitech solder paste in its domestic has a great influence, in 2014 on the independent research and development and production of T2-T10 particle size of the solder paste, only recently began to layout overseas, in fact, it is also more than 20 years of brand old shop.
Honey
With the use of Fuyinda's solder paste, fast tin down, strong oxidation resistance, good wettability, in particular, it can also be customised for the user's different scenarios of different alloys of solder powder, the configuration of different solder paste. This is for the modern electronics industry, the trend of ultra-micro is becoming more and more obvious, more and more popular with users.
