Fitech's lead-free & silver-free ultra-fine solder products are developed to solve the problem of electromigration due to the presence of silver in conventional SAC solder according to customers’ requirements. Products of such as SnCuX and SN100C alloys are offered in ultra-fine solder powder, no-clean solder paste, water soluble solder paste and epoxy solder adhesive with the particle size from Type 6 to Type 9 according to customers’needs. Lead-free & silver-free solder series has advantages such as good sphericity, narrow particle size distribution, no silver migration, bright solder joints and good wettability.