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Welcome to the Sz Fitech Solder News and Updates page.  Here you’ll find our latest press releases, company announcements, and essential industry news that shapes the modern solder landscape.

Can leaded solder paste and lead-free solder paste be used together?

Can leaded solder paste and lead-free solder paste be used together?

Properly reheating and mixing lead-free solder paste is a critical step in ensuring soldering quality, requiring attention to uniformity while preventing oxidation and bubble formation. Below are detailed steps and precautions:

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Reflow Soldering with Nitrogen Protection

Reflow Soldering with Nitrogen Protection

In the process of lead-free reflow soldering, many companies are concerned about one question, that is, whether the oxygen concentration in the reflow oven will rise? What circumstances need to use N2 to protect the soldering method to reduce the oxygen concentration in the reflow oven?

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How to Properly Reheat and Stir Lead-Free Solder Paste?

How to Properly Reheat and Stir Lead-Free Solder Paste?

Properly reheating and mixing lead-free solder paste is a critical step in ensuring soldering quality, requiring attention to uniformity while preventing oxidation and bubble formation. Below are detailed steps and precautions:

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Comparison of Advantages and Disadvantages Between ACF (Conductive Adhesive) and Solder Paste in Micro-Assembly

Comparison of Advantages and Disadvantages Between ACF (Conductive Adhesive) and Solder Paste in Micro-Assembly

In the field of micro-assembly, ACF (conductive adhesive) and solder paste serve as two core interconnect materials. Their comparative advantages and disadvantages must be comprehensively analyzed across dimensions such as electrical conductivity, process adaptability.

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Common PCB solderability inspection methods

Common PCB solderability inspection methods

PCB solderability inspection method refers to the use of certain methods and standards to evaluate the solderability of the pads or components on the PCB, that is, the wettability and interfacial reactivity between the solder and the solder.

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Pad surface treatment in microelectronics and semiconductor packaging

Pad surface treatment in microelectronics and semiconductor packaging

In microelectronics and semiconductor packaging, the most basic purpose of pad surface treatment is to ensure good solderability and conductivity of the pads. Since copper tends to exist as oxide in air and is unlikely to remain as pristine copper for long, other treatments are required for copper.

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Recommended well-known brands of high-temperature solder

Recommended well-known brands of high-temperature solder

In the field of high-temperature soldering, the selection of solder directly impacts both soldering quality and equipment reliability. As industrial manufacturing evolves toward higher precision and greater temperature resistance, the demand for high-temperature solder continues to grow.

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The mechanical strength of high-temperature gold-germanium solder

The mechanical strength of high-temperature gold-germanium solder

When talking about lead-free solder, people often think of tin-bismuth solder, tin-silver-copper solder, and tin-antimony solder. These solders have a wide range of applications, covering different soldering temperatures, but are limited to melting temperatures below 300°C.

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