What are the Competitiveness of Anisotropic Conductive Adhesive (ACA)?

Semiconductor packaging is now moving towards miniaturization, with increasing packaging densities. The new mini-LED display has developed rapidly in recent years. There are tens of thousands of chips on a mini-LED screen. Besides, the chip soldering temperature range of mini-LED is large, and the P-N pole spacing on the flip-chip pad is only 40-50

Application of Laser Solder Ball Soldering Process in Microelectromechanical Products

Microelectromechanical systems (MEMS) are systems that integrate miniature mechanical and electronic components with sensing, control, and actuation functions.MEMS products are widely used in automotive, medical, communications, aerospace, and other fields.

Addition of Silver Nanoparticles Improves Wettability of SnAgCu Solder Pastes

Koscielski, M., Bukat, K., Jakubowska, M., & Mlozniak, A. (2010). Application of silver nanoparticles to improve wettability of SnAgCu solder paste. 33rd International Spring Seminar on Electronics Technology, ISSE 2010. doi:10.1109/isse.2010.5547345.

What are the types of PCB pad processes?

Choose HASL or OSP for low cost and large pitch; choose ENIG for fine pitch and high reliability; choose hard gold plating for frequent plugging and unplugging or high abrasion resistance; choose ENIG or ENEPIG for high humidity or long term storage; choose ENIG or ENEPIG for comprehensive product cost, reliability requirements, and component type.

Specific meaning and analysis of the 5M1E of production operations

5M1E is an acronym for the six core elements used in production management and quality control to analyse the quality of a product or process, which are known as Man, Machine, Material, Method, Measurement and Environment. The initial letters of these six factors are M and E, so they are collectively called 5M1E.

Difference between soft and hard brazing consumables

Soft brazing consumables and hard brazing consumables are two types of core materials in the brazing process, and their differences are mainly reflected in melting point, composition, properties, application scenarios and process requirements.

Tin Whisker Growth of SAC305 Solder Paste in Corrosive Environment

Sometimes white whiskers can be found at the solder joint of SMT devices. This is probably due to the growth of tin whiskers on the leads. The occurrence of tin whiskers may cause short-circuit problems. Tin whisker is a natural phenomenon in tin-containing solders.

An overview of the grain boundary strengthening mechanism of Sn-Bi-Ag low-temperature solder paste

he crystal boundary strengthening mechanism of Sn-Bi-Ag low-temperature solder paste is a multifactorial synergistic process, which is described in detail below from three perspectives: the specific role of each mechanism, research cases and data support, and synergistic effect: