What are the Requirements for Lead-Free Solder Pastes from an Industrial Application Point of View?

At present, there is no universally recognized set of specifications for lead-free solder pastes. From the perspective of industrial application, the following basic technologies and application requirements of lead-free solder pastes are summarized:

Why Does the Stencil Determine Whether a Solder Paste Is Good?

The stencil directly determines solder-paste printing quality and therefore affects soldering performance, making it a key factor in evaluating solder-paste quality. The specific reasons are as follows:

A Brief Discussion of EDA Packaging

Electronic design automation (EDA) packaging can be approached through the following steps:

Differences Between Water-Soluble and No-Clean Solder Paste

Water-soluble solder paste and no-clean solder paste differ significantly in composition, performance, application scenarios, cost, and future trends.

How to Quickly Evaluate Solder Paste Quality

A quick evaluation of solder paste quality should combine three dimensions: visual inspection, basic performance testing, and simple process verification. The following methods use direct checks and rapid experiments to screen out low-quality products.

Pillow-Head Effect in BGA and CSP Package

With the BGA, CSP package devices to dense pitch, miniaturisation of the direction of development, the widespread application of lead-free processes to the electronic assembly process has brought new challenges. Pillow-head effect are BGA, CSP device reflow soldering is unique to a defective form.

A Brief Discussion on Sedimentation, Stratification, and Oil Separation in Solder Paste

Solder paste sedimentation typically refers to the separation of components and oil separation that occurs during storage:

The Parameters Affecting Centrifugal Atomized Solder Powder

Semiconductor packaging processes such as SMT, BGA, solid crystal, etc. often use solder paste. Solder paste is composed of solder powder and flux. The highest proportion is solder powder.