How to Avoid the Problem of Dropping Parts of the Second Reflow When Double-Sided Mounting?

Double-sided mounting process can improve the actual utilisation of PCB, reduce manufacturing costs, and meet the demand for miniaturisation and high integration of end products. However, the use of double-sided mounting, double-sided reflow process will bring the following problems.

Solder Paste for Mini LED Package

Mini LED is a new type of display technology that uses 50-200 micron LED chips as backlight or pixel units, achieving excellent display effects such as high brightness, high contrast and high colour gamut, etc.

What causes solder paste to remain in the heat sink holes?

Failure to thoroughly clean solder paste from the heat dissipation holes may be caused by various factors, including the cleaning process, material properties, equipment operation, or design flaws. The following are the specific causes and analysis:

How can the risk of the popcorn effect be reduced through solder paste process control?

The following solder paste process control measures can effectively reduce the risk of the "popcorn effect":

Causes and mitigation measures of voids during soldering

Transient liquid phase (TLP) bonding is a common bonding technique in high-temperature electronic devices, especially in power device packaging. TLP bonding can be carried out at lower temperatures and can remain stable at higher temperatures.

Common PCBA cleaning solution

After soldering, PCBAs need to be cleaned to remove solder dross, flux, dust and other contaminants from the board to improve its reliability and performance. Current PCBA cleaning solutions are in full bloom, each cleaning solution in different application scenarios to show the unique advantages.

A Brief Discussion on the Standard Viscosity Range for Lead-Free Solder Paste

The standard viscosity range for lead-free solder paste is typically 80–250 Pa·s (or 80,000–250,000 cP), but specific values must be adjusted based on the printing process, equipment, and product requirements. The following is a detailed analysis:

Classification and selection of wave soldering flux

Wave Soldering is a common PCB soldering technique in which electronic components and boards (pre-applied flux in the soldered area of the board) are placed on a wave of melted solder to make a soldered connection.