Difference between soft and hard brazing consumables

Soft brazing consumables and hard brazing consumables are two types of core materials in the brazing process, and their differences are mainly reflected in melting point, composition, properties, application scenarios and process requirements.

Tin Whisker Growth of SAC305 Solder Paste in Corrosive Environment

Sometimes white whiskers can be found at the solder joint of SMT devices. This is probably due to the growth of tin whiskers on the leads. The occurrence of tin whiskers may cause short-circuit problems. Tin whisker is a natural phenomenon in tin-containing solders.

An overview of the grain boundary strengthening mechanism of Sn-Bi-Ag low-temperature solder paste

he crystal boundary strengthening mechanism of Sn-Bi-Ag low-temperature solder paste is a multifactorial synergistic process, which is described in detail below from three perspectives: the specific role of each mechanism, research cases and data support, and synergistic effect:

PCBA processing paste selection of the "five-dimensional evaluation method"

In PCBA processing, solder paste selection is a key link in determining solder quality, reliability and productivity.The "5-Dimensional Evaluation Method" is a systematic and structured selection method, which comprehensively considers the five core dimensions of alloy composition and performance, process adaptability, solder reliability

Abnormal Growth and Cracking of IMC in ENIG Electroless Nickel-gold Plating

ENIG (Electroless Nickel Immersion Gold) is a widely used process for PCB surface treatment, also known as immersion gold or electroless nickel gold. The gold layer of ENIG is thinner and less dense than that of electroless gold plated boards.

Solder paste tin splattering causes and solutions

Solder paste soldering tin splattering refers to the soldering process, high temperature soldering iron tip contact solder paste, solder paste instantly produce a violent reaction, issued by the explosion sound and splattered small tin beads of the phenomenon. The following are the main reasons for tin splattering and solutions:

Is the export of solder paste regulated?

Solder paste exports are not all controlled, but companies need to assess the risk based on product composition, use and target market dynamics.It is recommended to establish a compliance system, including composition testing, licence application, declaration specifications, etc., in order to avoid legal risks.

In-depth analysis of solder paste viscosity standards

Solder paste viscosity standards need to be combined with specific application scenarios, test methods and industry standards to make a comprehensive judgement.By accurately controlling the viscosity and thixotropic properties, SMT process yields can be significantly improved, and printing defects and soldering problems can be avoided.