What is SMT solder paste process and red glue process?

SMT solder paste process and red glue process are two key processes in electronic manufacturing, the main difference lies in the material characteristics, process purpose and applicable scenarios.The following is a detailed analysis:

Detailed explanation of the solder paste process in the soldering defect phenomenon

What is the difference between solid crystal solder paste and conventional SMT solder paste?

If confused use (such as solid crystal with SMT solder paste), may lead to heat damage to the chip or bonding strength is insufficient; Conversely, solid crystal solder paste welding components may be due to poor wettability resulting in poor welding.

Difference between BGA flux paste and normal flux paste?

There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:

What can I do to fix dry solder paste?

What is the difference between laser solder paste and regular solder paste?

The difference between laser solder paste and ordinary solder paste is mainly reflected in its composition, soldering mechanism, performance advantages and application areas, the following is a more detailed analysis:

Mechanism of Intermetallic Compound Formation

Intermetallic compounds are a class of substances formed by chemical bonding of metallic elements in specific atomic proportions.

PCBA Conformal Coating Process Corrosion Failure Analysis

Conformal coating, refers to the addition of a layer of protective coating to protect products and improve product reliability, three-proof paint plays a role in isolating electronic components and circuit boards from harsh environments.