Wave Soldering Solder Pull Tip is How to Form

Wave soldering, sometimes found at the top of the components and pins or solder joints with icicle or stalactite-like solder, this phenomenon is called pull tip, as shown in Figure.

What is the difference between solid crystal solder paste and red glue?

Solid crystal solder paste and red glue are two common materials in the field of electronic packaging, and they have significant differences in composition, function, process, performance and application.

Printing Solder Paste_ Electroforming Process for Stencil Manufacturing

Shenzhen Fitech can provide solder paste products for the printing process. Fitech’s printing solder paste has adjustable viscosity, guaranteeing excellent printability and solder release performance. The products can help customers eliminate their concerns about the unstable printing performance of solder paste. Welcome to inquire for more infor

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

SZ Fitech Invites You to SEMICON Southeast Asia 2025

As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025.

What are the Characteristics of Water-Soluble Solder Paste_Solder Paste Cleaning

The traditional solder flux is formulated with rosin or epoxy resin as the base material, mixing with an active agent, thixotropic agent, solvent, and other substances. At present, two major factions of no-clean solder paste and water-soluble solder paste have been derived based on flux compositions. No-clean solder paste, as the name suggests, pro

What is SMT solder paste process and red glue process?

SMT solder paste process and red glue process are two key processes in electronic manufacturing, the main difference lies in the material characteristics, process purpose and applicable scenarios.The following is a detailed analysis:

Detailed explanation of the solder paste process in the soldering defect phenomenon

In the solder paste process, soldering defect phenomenon is a common soldering defect that manifests itself as a solder joint that appears to be connected on the surface but actually has poor electrical contact or insufficient mechanical strength.