PCBA processing paste selection of the "five-dimensional evaluation method"

In PCBA processing, solder paste selection is a key link in determining solder quality, reliability and productivity.The "5-Dimensional Evaluation Method" is a systematic and structured selection method, which comprehensively considers the five core dimensions of alloy composition and performance, process adaptability, solder reliability

Abnormal Growth and Cracking of IMC in ENIG Electroless Nickel-gold Plating

ENIG (Electroless Nickel Immersion Gold) is a widely used process for PCB surface treatment, also known as immersion gold or electroless nickel gold. The gold layer of ENIG is thinner and less dense than that of electroless gold plated boards.

Solder paste tin splattering causes and solutions

Solder paste soldering tin splattering refers to the soldering process, high temperature soldering iron tip contact solder paste, solder paste instantly produce a violent reaction, issued by the explosion sound and splattered small tin beads of the phenomenon. The following are the main reasons for tin splattering and solutions:

Is the export of solder paste regulated?

Solder paste exports are not all controlled, but companies need to assess the risk based on product composition, use and target market dynamics.It is recommended to establish a compliance system, including composition testing, licence application, declaration specifications, etc., in order to avoid legal risks.

In-depth analysis of solder paste viscosity standards

Solder paste viscosity standards need to be combined with specific application scenarios, test methods and industry standards to make a comprehensive judgement.By accurately controlling the viscosity and thixotropic properties, SMT process yields can be significantly improved, and printing defects and soldering problems can be avoided.

What solder paste do I need to solder a mobile phone motherboard?

Soldering mobile phone motherboards requires the selection of solder paste suitable for high-density, fine solder joints, and the following are key factors and recommendations:

Device failure due to SMT wick effect

The wick effect, also known as the creeping tin effect, is an inherent characteristic of solder in the PCB soldering mechanism: "solder always flows from low temperature to high temperature", which means that the nature of solder is to go where the temperature is high.

What are the brands of solder paste widely used in China at present?

The widely used solder paste brands in China include both internationally renowned brands and excellent local manufacturers.