Comparison of Advantages and Disadvantages Between ACF (Conductive Adhesive) and Solder Paste in Micro-Assembly

In the field of micro-assembly, ACF (conductive adhesive) and solder paste serve as two core interconnect materials. Their comparative advantages and disadvantages must be comprehensively analyzed across dimensions such as electrical conductivity, process adaptability, reliability, cost, and environmental friendliness, as detailed below:

I. Conductive Performance: Nano-Optimized Fuyingda ACF

Fuyingda's ACF products utilize micro-nano conductive particles (e.g., gold, silver, tin-based metals) with particle sizes as low as 1-3μm, suitable for ultra-fine connections with line width/spacing ≤15μm (e.g., Mini LED chip bonding). Z-axis electrical resistance can be reduced to <10mΩ, approaching solder paste levels, while X-Y axis insulation resistance exceeds >10⁸Ω, effectively preventing short circuits.

II. Process Adaptability: Low-Temperature Curing and Template-Free Processes

Fuyingda ACF supports rapid low-temperature curing at 180°C/5 seconds or UV curing, compatible with heat-sensitive components (e.g., plastic substrates). Utilizing preformed films or dispensed ACF eliminates custom stencil requirements, simplifying processes for small-batch, multi-variety production (e.g., wearable device prototyping). In contrast, solder paste relies on stencil printing and high-temperature reflow, resulting in higher process complexity.

III. Reliability: Fatigue Resistance and Environmental Durability Design

Fuyingda ACF utilizes a flexible polymer matrix with narrowly distributed conductive particles. After 100,000 bending cycles (1mm radius), contact resistance variation remains <5%, making it suitable for dynamic applications like foldable screens and AR glasses. Its nano-encapsulation technology blocks oxygen and moisture, maintaining insulation resistance >10⁶Ω after 1000 hours at 85°C/85%RH—outperforming traditional ACF.

IV. Cost and Environmental Performance: Cost-Effectiveness and Green Formulation

Fuyingda reduces precious metal usage through gold/silver/tin-coated copper/nickel particle composite technology, lowering costs by 20%-30% compared to traditional ACF—approaching mid-range solder paste pricing. The entire product line complies with RoHS and REACH standards. Its halogen-free formulation achieves VOC emissions <50ppm, meeting EU environmental requirements. In contrast, solder pastes require balancing lead-free costs with flux residue risks.

V. Application Scenario Positioning

Fuyingda ACF targets ultra-miniaturization, dynamic stress, and thermally sensitive packaging (e.g., foldable screen hinges, OLED driver chips), filling gaps in micro-pitch (<50μm) and flexible connections where solder paste falls short. Solder paste remains dominant in traditional PCB assembly, high-reliability structures, and large-scale automated production.

VI. Industry Trend Alignment

Fuyingda's technological trajectory—micro/nano-scale, low-temperature, and high-reliability—aligns with advanced packaging trends like SiP (System-in-Package) and Chiplet. It is poised to play a pivotal role in 3D integration and heterogeneous integration, while solder paste must upgrade through ultra-fine powderization and rapid curing to maintain competitiveness.

Through micro-nano material design and process innovation, Fuyingda has carved a differentiated path for ACF in micro-assembly applications, particularly excelling in ultra-fine, flexible, and eco-friendly scenarios. Meanwhile, solder paste continues to dominate traditional markets with its high reliability based on metallurgical bonding. These complementary technological approaches jointly propel microelectronic packaging toward higher density, lower cost, and greener solutions.