Ultra-Fine Dispensing Solder Paste

FH-260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260D series solder paste. It is a high-temperature lead-free product developed for secondary reflow soldering of power semiconductor and microelectronic packaging. FH-260 is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, which successfully replaces high-lead solder paste and meets RoHS environmental protection standards. 

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

An80Sn20 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-280 series solder paste. FH-280 has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. In addition, the solder paste has outstanding wettability, anti-slump, anti-collapse and less residual performance. There is no solder ball formation during soldering. Moreover, FH-280 has high tensile strength, excellent corrosion resistance, high melting point, and extraordinary thermal creep performance. FH-280 is compatible with other precious metals and has excellent electrical and thermal conductivity. The product is suitable for the high-reliability packaging of semiconductors and microelectronic devices. It is applied to the high thermal conductivity packaging of high-power devicesdevices.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

The main alloy component of  FSA-170D series epoxy solder paste is Fitech’s FL170 low-temperature alloy solder powder (SnBiAgX).  Fitech classifies FL170 solder powders into T4 to T7 based on particle sizes. The solder powder and epoxy-based flux are formulated into superior low-temperature high-reliability solder paste.

1. Excellent sphericity, uniform particle size, low oxygen content, and high strength;

2. Reduce solvent volatilization during the curing process;

3. Halogen-free, no clean；
4. Reduce solder ball formation after soldering;

5. The solder joints are metallurgically connected, which are equivalent to the soldering effects of solder paste;

6. The soldering residue becomes thermosetting adhesive, which is attached around the solder joint to improve its strength and enhance the anti-corrosion and insulation performance;

7. It is suitable for reliable packaging of thin substrates and non-heat-resistant components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

FSA-305D series medium-temperature fine-pitch ultra-fine solder paste (SnAgCu epoxy solder paste) is composed of SAC305 solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. Compared with rosin solder paste, the solder residue becomes thermosetting adhesive to enhance the solder joint strength, corrosion resistance, and insulation. FSA-305 is a type of no-clean solder paste. It is a superior solder for medium temperature soldering.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

FSA-574D series low-temperature lead-free epoxy solder paste is composed of low-temperature ultra-fine SnBi solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and solidification process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-574D epoxy solder paste is unnecessary to clean. Solder residue becomes thermosetting adhesive to reinforce the solder joints and enhance the anti-corrosion and insulation performance. FSA-574D is suitable for the reliable packaging of thin substrates and non-heat-resistant components.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.

The FTD-125 can refine the IMCs, which allows a better soldering strength, fewer residues, and excellent wettability. The SAC125 (SnAgCuNi) solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to produce FTD-125 dispensing/jetting solder paste. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent satellite solder ball inhibition, anti-collapse and less residual performance.FTD-125 is suitable for micro-bump ultra-fine-pitch soldering.

 1.Available for dispending and jetting process; 

 2. FTD-125 can refine the IMCs, allows higher mechanical strength; 

 3. Using narrow-distribution ultrafine powder, the solder paste has stable performance and good anti-collapse property, suitable for narrow-pitch packaging; 

 4. Excellent chemical activity, no satellite solder ball, and good wettability; 

 5. Simple operation, able to choose from reflow oven, heating plate, oven; 

 6. Good thixotropy, proper viscosity, superior stability, no stratification, and long working life.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

FTD-0176 dispensing solder paste adopts SnCuX silver-free formulation, eliminating the impact of silver migration. SnCuX silver-free solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to produce FTD-0176 series solder paste. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-collapse and less residual performance.FTD-0176 is suitable for micro-bump ultra-fine-pitch soldering.

1. Available for dispending and jetting process；
2. No silver migration effect and fewer residue generation;

3. FTD-0176 adopts ultra-fine solder powder formulation with narrow particle size distribution, which ensuresstable solder paste discharge and anti-collapse performance

4. It has outstanding thixotropy and appropriate viscosity;

5. Excellent chemical activity, satellite solder paste discharge and anti-collapse, and good wettability;

6. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTD-305 series solder paste. The solder paste has superior adhesion before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTD-305  has outstanding wettability, anti-slump,anti-collapse and less residual performance.There is no solder ball formation during soldering. The product is an ideal solder for micro-bump ultra-fine-pitch packaging.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.Recovery 

time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

SAC305plus composite solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with halogen-free flux to produce SAC305plus dispensing solder paste. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability,anti-collapse and less residual performance.Micro-/Nano-particle is added to enhance the solder tackiness of secondary reflow solder joints, achieving secondary reflow soldering. SAC305 plus composite solder paste is a high-temperature solder product applicable for secondary reflow soldering, which can replace sintered silver pastes, copper pastes, and high-lead solder products.

1. Better thermal and electrical conductivity than sintered silver paste and sintered copper paste;

2. Micro-/Nano-particle is added to enhance the solder tackiness of secondary reflow solder joints, achieving secondary reflow soldering;

3. Outstanding solder release and anti-collapse performance make it suitable for ultra-fine-pitch soldering;

4. Excellent chemical activity, no solder ball,  good wettability;

5. Good thixotropy, proper viscosity, superior stability, no stratification,  long working life.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Fitech’s tin-bismuth-silver solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with excellent halogen-free flux to prepare FTD-574 series low-temperature solder paste. Solvent volatilizes very slightly during soldering. There is no solder ball formation during soldering, and only a small amount of residue is produced after soldering. Moreover, FTD-574 has outstanding wettability. The solder joints generated are plump and bright. The product is effective for low-temperature component mounting. 

1、Storage and Recovery Instruction: Solder paste is normally stored in a refrigerator with -5~10℃. When solder paste is taken out of the cold box,its temperature is much lower than room temperature. If use without the recovery process varies damage may be caused to the paste. Opening the cap of sealing may cause water vapor in the air to condense on the paste. If this occurs, later in the reflow furnace (temperature over 150 ℃ ), water would vaporize due to strong heat.This may lead to solder explosion and damage the chip.

2、Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

3、Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

4. Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste

5. Operating Environment:The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

6. Operating Time

① Continuous printing time: When adding solder paste continuously: 8 hours; In case of discontinuous addition of solder paste: 4 hours; ② Please add solder paste before the solder paste on the board is almost one third (rolling diameter: 10mm or less); ③ Please keep the solder paste on the plate within 3 hours; ④ If printing is interrupted for more than 30 minutes, please clean the stencil. ⑤ Dwell time after printing: After the solder paste is printed, the components should be mounted as soon as possible and the soldering should be completed when passing the oven to avoid drying out the surface of the solder paste due to long storage, which will affect the component mounting and soldering effects. Generally, the recommended dwell time of solder paste is no more than 4 hours, while the low temperature bismuth-containing solder paste does not exceed 2 hours. If the printing is interrupted for more than 30 minutes or is temporarily interrupted, the printing template needs to be cleaned. It can continue to work after 1-2 trial printing. The solder paste attached to narrow space of the opening (≤0.4mm) and the opening of the stencil will gradually dry, which will degenerate the adhesive ability.

SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTD-901 series solder paste based on metallurgical method and chemical structure. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTD-901 has outstanding wettability,anti-collapse and less residual performance. It is developed to meet the market demand for heat-resistant microelectronic assembly and precision soldering. The product has extraordinary heat resistance and heat dissipation abilities. It also improves the voiding of solder joints and the strength and conductivity of intermetallic compounds.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.