T8 Ultra-Fine Solder Paste

With the continuous miniaturization of electronic components, the evolving semiconductor packaging is placing newer requirements on packaging solders. For semiconductor packaging solder paste, an important requirement is the ultra-micronization of solder powder. Especially in the new display industry, the pixel pitch of Mini LED/Micro LED display technology has been reduced to less than 1mm or even less than 0.5mm. The size of display chips has been reduced to 100um or even less than 50um, which puts forward high requirements of packaging solder paste. Currently, several major suppliers are still selling T7(2-11μm), T6 (5-15μm) solder pastes and other solder pastes with particle sizes greater than 15μm. T8 solder paste products are still under development.

Nearly 20 years ago, Fitech took the lead in the development and production of ultra-fine solders in the world and took the lead in launching T8 and T9 ultra-fine powder and solder paste products.

T8 solder sphericity comparison between Fitech and international counterparts

Fitech'sT8 ultra-fine solder powder (2-8μm >94%) is perfect full and round, and the sphericity can reach 100%.

High sphericity and concentrated particle size distribution improve Fitech'sT8 solder paste reliablity.

● Benefits of high sphericity:

◆ Smooth solder release

◆ Uniform solder joints

◆ High reliablity

◆ Reduced likelihood of needle blockage

◆ Longer equipment life

● Viscosity stability of continuous printing solder paste

Blue line: Fitech's product
Organe line: Normal product

Fitech's ultra-fine solder powder has better anti-oxidation effect and viscosity stability.
Superior oxidation resistance significantly enhances Fitech's T8 solder paste stability.