Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Medium and high temperature solder adhesive (epoxy solder paste) is a solder using SnAgCu alloy and SnSb alloy as metal filler particles. Compared with medium and high temperature solder paste, epoxy resin or silicone resin is used to replace rosin resin. The application of solder adhesive is the same as solder paste. After reflow, the alloy powder and soldering pad are metallurgically connected. Resin component cures and becomes thermoset adhesive around solder joints, which makes it unnecessary to clean. The thermoset adhesive reinforces and boosts the electrical performance of solder joints. Solder adhesive is a new type of electronic packaging material.