Low-Temperature Ultra-Fine Epoxy Solder Paste

The melting point of the low-temperature epoxy solder paste alloy is below 180℃.The low-temperature epoxy solder paste is made of bismuth-based alloy. The existence of bismuth-rich layers easily causes a brittle fracture, poor dropping performance, and poor solderability. The low-temperature solder adhesive is composed of epoxy resin and other polymer materials to strengthen solder joints and improve drop resistance. Meanwhile, the excellent electrical insulation and protection of the resin glue can enhance the reliability of the packaging substrate. Low-temperature epoxy solder paste is very suitable for the packaging of thin substrates, non-heat-resistant devices, and high-reliability devices. Epoxy solder paste is a new type of packaging material.