Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

The use of micro- and nano-enhanced particles dispersed in the solder refines the organisational structure and inhibits the enrichment of Bi, whose reliability is significantly improved.

Can achieve 170~200℃ low temperature welding, suitable for non-heat-resistant components and thin substrate chips.

Wide range of uses, can be used for printing, dispensing, needle transfer, dip glue, spray printing and other processes.

Particle size range T5 to T8, suitable for various solder joint spacing.The product has been patented in the United States and Japan.