The alloy component of eutectic gold-tin solder paste for power devices consists of 80wt% of gold and 20wt% of tin (Au80Sn20). Under the impacts of eutectic gold-tin solder paste properties and Fitech’s advanced powder manufacturing technology, Fitech’s eutectic gold-tin solder paste has several advantages such as high tensile strength, excellent corrosion resistance, outstanding thermal creep performance, and superior compatibility with other precious metals. It also has excellent performance of electrical conductivity and thermal conductivity.

Description
FH-280 series is eutectic gold-tin solder paste with a melting point of 280℃. It is suitable for high-reliability packaging of semiconductors and microelectronic devices and high thermal-conductive packaging of high-power devices. The melting point of gold-tin solder paste is high. Therefore, FH-280 can be used to avoid melting and failure of solder joints in secondary reflow. It has been used in military, aerospace, medical, and other fields. FH-280 gold-tin solder paste has excellent thixotropy, suitable viscosity, outstanding wettability, and brilliant soldering performance. In addition, it has a high melting point, high tensile strength, excellent oxidation and corrosion resistance, extraordinary thermal conductivity, and superior electrical conductivity. It complies with RoHS standards. It exhibits stable performance under high-temperature operation.

Features 

1. FH-280 is a type of solder paste with a high melting point and high tensile strength.

2. It has superior anti-oxidation and anti-corrosion performance, and it is compatible with other precious metals; 

3. It has outstanding thixotropy, suitable viscosity, excellent wettability, high tensile strength and extraordinary soldering performance; 

4. It has excellent thermal conductivity and electrical conductivity;

5. It is the priority choice in reflow soldering because of its high melting point;6. It complies with RoHS standards.

High-temperature lead-free solder paste for power devices is the solder paste with a minimum alloy melting point of 260°C., which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging. It is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. Different solder powder particle sizes and metal contents can be provided to satisfy various customers’ requirements for products and processes.

Description
FH260 solder powder with excellent sphericity, uniform particle size, and low oxygen content is combined with halogen-free flux to produce FH-260 series solder paste. It is a high-temperature lead-free product developed for secondary reflow soldering of power semiconductor and microelectronic packaging. The alloy is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. FH-260P series and FH-260D series are adapted to printing and dispensing processes, respectively.

Features 

1. FH260 is a lead-free antimony-free product exempt from RoHS;

2. It has excellent thixotropy, viscosity, wettability, and solderability;

3. It is achievable for high-density integrated circuit packaging and secondary reflow soldering of circuit boards;

4. The use of ultra-fine powder improves ultra-fine-pitch and micro-assembly printing performance;

5. It is a no-clean halogen-free product that only produces a tiny amount of residue.

Features
1. Excellent water cleaning performance to reach high soldering reliability;

2. Outstanding wettability;

3. Suitable for the packaging of micro-bump and ultra-fine-pitch component, providing extraordinary printing performance;

4. Extraordinary slump resistance;

5. Applicable to jet printing, pin transfer, dispensing, and printing with outstanding thixotropy and suitable viscosity;

6. Superior wettability and chemical activity;

7. Comply with RoHS and halogen-free environmental protection specifications.

Description
SnSb10 alloy solder powder with excellent sphericity, uniform particle size, and low oxygen content is mixed with no-clean flux to produce FTP-901/FTD-901 series solder paste based on metallurgical method and chemical structure. It has an outstanding adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. It is developed to meet the market demand for heat-resistant microelectronic device assembly and precision soldering. FTP-901/FTD-901 has a superior heat resistance and heat dissipation performance. It also improves the soldering voiding and the strength and conductivity of intermetallic compounds. 

Features

1. FT-901 has extraordinary thermal conductivity, electrical conductivity, and soldering strength;

2. Special ultra-fine solder powder satisfies high-power chip soldering with a size exceeding 20mil;

3. The operation is simple. Reflow oven, electric hot plate, and stove can be used;

4. It has advantages such as outstanding thixotropy, appropriate viscosity, excellent stability, no delamination, and long operating life;

5. The creep resistance of FT-901 is extraordinary, and it has heat resistance better than that of SAC305 alloy.

Description
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305/FTD-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. It is an ideal soldering material for micro-bump ultra-fine-pitch packaging.

Features 

1. FTP-305/FTD-305 has better thermal conductivity and electrical conductivity than that of silver conductive adhesive;

2. The ultra-fine solder powder has narrow size distribution. FTP-305/FTD-305 has stable solder paste printing and outstanding anti-slump performance, and it is suitable for ultra-fine-pitch packaging;

3. It has excellent chemical activity, solder ball elimination, and wettability;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has excellent viscosity, outstanding stability, no delamination, and long stencil life.