What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

What are the types of PCB pad processes?

Choose HASL or OSP for low cost and large pitch; choose ENIG for fine pitch and high reliability; choose hard gold plating for frequent plugging and unplugging or high abrasion resistance; choose ENIG or ENEPIG for high humidity or long term storage; choose ENIG or ENEPIG for comprehensive product cost, reliability requirements, and component type.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.

Specific meaning and analysis of the 5M1E of production operations

5M1E is an acronym for the six core elements used in production management and quality control to analyse the quality of a product or process, which are known as Man, Machine, Material, Method, Measurement and Environment. The initial letters of these six factors are M and E, so they are collectively called 5M1E.

What is the Soldering drawbridge effect?

Welding drawbridge effect is a typical defect in SMT chip processing, need to optimise the design, process control and material selection comprehensive solution. Its name comes from the phenomenon resembles a drawbridge, but no direct correlation with the psychological "drawbridge effect", belongs to the engineering field of terminology.

Difference between soft and hard brazing consumables

Soft brazing consumables and hard brazing consumables are two types of core materials in the brazing process, and their differences are mainly reflected in melting point, composition, properties, application scenarios and process requirements.

What should I do if the solder paste does not adhere to the pads?

Solder paste not adhering to the pad is a common problem in electronic soldering, usually caused by oxidation, contamination, insufficient temperature or solder/flux problems. The following are the detailed troubleshooting and solutions:

Tin Whisker Growth of SAC305 Solder Paste in Corrosive Environment

Sometimes white whiskers can be found at the solder joint of SMT devices. This is probably due to the growth of tin whiskers on the leads. The occurrence of tin whiskers may cause short-circuit problems. Tin whisker is a natural phenomenon in tin-containing solders.