PCBA processing paste selection of the "five-dimensional evaluation method"

In PCBA processing, solder paste selection is a key link in determining solder quality, reliability and productivity.The "5-Dimensional Evaluation Method" is a systematic and structured selection method, which comprehensively considers the five core dimensions of alloy composition and performance, process adaptability, solder reliability

Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering

Solder paste is a mixture of tin powder particles and flux paste. The flux in the solder paste has four static properties and four dynamic properties. The four dynamic properties of the industry is often referred to as flux to remove the oxide layer, prevent re oxidation, reduce the surface tension of liquid solder

Abnormal Growth and Cracking of IMC in ENIG Electroless Nickel-gold Plating

ENIG (Electroless Nickel Immersion Gold) is a widely used process for PCB surface treatment, also known as immersion gold or electroless nickel gold. The gold layer of ENIG is thinner and less dense than that of electroless gold plated boards.

What are the steps in the lead-free soldering process?

The core steps of the lead-free soldering process are listed below, each of which contains key control points to ensure solder quality:

Solder paste tin splattering causes and solutions

Solder paste soldering tin splattering refers to the soldering process, high temperature soldering iron tip contact solder paste, solder paste instantly produce a violent reaction, issued by the explosion sound and splattered small tin beads of the phenomenon. The following are the main reasons for tin splattering and solutions:

What is Kirkendall Hollow

Is the export of solder paste regulated?

Solder paste exports are not all controlled, but companies need to assess the risk based on product composition, use and target market dynamics.It is recommended to establish a compliance system, including composition testing, licence application, declaration specifications, etc., in order to avoid legal risks.

Dynamic thermal deformation curves for commonly used BGA packages

Analysis of P-BGA and F-BGA thermal deformation process and stencil opening optimisation