The Prospect of SAC305 Nano-Solder Paste and Microwave Hybrid Heating

SAC305 has been widely used as a substitute for lead solder on the market. The reliability of SAC305 has always been a concern in the industry.

Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.

What are the Competitiveness of Anisotropic Conductive Adhesive (ACA)?

Semiconductor packaging is now moving towards miniaturization, with increasing packaging densities. The new mini-LED display has developed rapidly in recent years. There are tens of thousands of chips on a mini-LED screen. Besides, the chip soldering temperature range of mini-LED is large, and the P-N pole spacing on the flip-chip pad is only 40-50

Solder Paste Jetting Process Introduction

The jetting process is an emerging non-contact solder paste deposition technology that utilizes a high-speed jetting valve to spray tiny solder paste droplets onto the pads of printed circuit boards -PCBs to achieve on-demand, precise deposition of solder paste.

Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used

Application of Laser Solder Ball Soldering Process in Microelectromechanical Products

Microelectromechanical systems (MEMS) are systems that integrate miniature mechanical and electronic components with sensing, control, and actuation functions.MEMS products are widely used in automotive, medical, communications, aerospace, and other fields.

Impact of solder paste printing on the success rate of reflow soldering

According to statistics, in the PCB design is correct, components and printed board quality is guaranteed under the premise of surface assembly quality problems in nearly 70% is out of the solder paste printing process. Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform。

Addition of Silver Nanoparticles Improves Wettability of SnAgCu Solder Pastes

Koscielski, M., Bukat, K., Jakubowska, M., & Mlozniak, A. (2010). Application of silver nanoparticles to improve wettability of SnAgCu solder paste. 33rd International Spring Seminar on Electronics Technology, ISSE 2010. doi:10.1109/isse.2010.5547345.