Solder Paste Jetting Process Introduction

The jetting process is an emerging non-contact solder paste deposition technology that utilizes a high-speed jetting valve to spray tiny solder paste droplets onto the pads of printed circuit boards -PCBs to achieve on-demand, precise deposition of solder paste.

Improve Package Reliability and Efficiency with Low-Temperature SnBi Epoxy Solder Paste

The use of low-temperature solder paste in the electronics industry is gaining attention, especially with the miniaturization of integrated circuit components and the increase in the number of I/Os. While the traditional lead-free SAC solder reflow process is commonly used

Application of Laser Solder Ball Soldering Process in Microelectromechanical Products

Microelectromechanical systems (MEMS) are systems that integrate miniature mechanical and electronic components with sensing, control, and actuation functions.MEMS products are widely used in automotive, medical, communications, aerospace, and other fields.

Impact of solder paste printing on the success rate of reflow soldering

According to statistics, in the PCB design is correct, components and printed board quality is guaranteed under the premise of surface assembly quality problems in nearly 70% is out of the solder paste printing process. Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform。

Addition of Silver Nanoparticles Improves Wettability of SnAgCu Solder Pastes

Koscielski, M., Bukat, K., Jakubowska, M., & Mlozniak, A. (2010). Application of silver nanoparticles to improve wettability of SnAgCu solder paste. 33rd International Spring Seminar on Electronics Technology, ISSE 2010. doi:10.1109/isse.2010.5547345.

What indicators are usually included in checking the quality of solder paste?

Checking the quality of solder paste usually requires a comprehensive assessment from a number of dimensions such as physical properties, chemical properties, soldering performance, composition compliance and process reliability.

What are the types of PCB pad processes?

Choose HASL or OSP for low cost and large pitch; choose ENIG for fine pitch and high reliability; choose hard gold plating for frequent plugging and unplugging or high abrasion resistance; choose ENIG or ENEPIG for high humidity or long term storage; choose ENIG or ENEPIG for comprehensive product cost, reliability requirements, and component type.

Distance requirements for solder paste process SMD pads and inline pads?

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, component interference, and ensures soldering reliability.