Ultra-Fine-Pitch LED Display Chip Structure and Selection of Lead-Free Solder Paste for Flip-Chip LEDs

Wire-bonding LED chips, vertical LED chips, and flip-chip LEDs are three different structures of LED chips. Different structures of LED chips influence the selection of lead-free solder pastes.

How to Classify Lead-Free Solder Pastes and Achieve Lead-Free Soldering?

Definition：Lead-free solder paste has developed rapidly as an alternative to leaded solder paste. EU’s RoHS ISO9453 and Japan's JEIDA stipulate that solder alloys with Pb content less than 0.1wt% (1000ppm) can be defined as lead-free solder alloys.

Top 10 Best Recognised Solder Paste Brands

Solving extreme welding challenges with breakthrough technology, these brands are core suppliers for high-end manufacturing, but are expensive for scenarios that demand the ultimate in materials, temperature or reliability.

An overview of how solder paste cools down chips?

By optimising the thermal conductivity of the material, strengthening the metallurgical connection structure and adapting the alloy design to different application scenarios, solder paste achieves efficient heat dissipation of the chip.

Non-wetting and De-wetting during Soldering

Non-wetting and de-wetting phenomenon is a common defect in the welding process, they are respectively manifested as incomplete contact between solder and base metal and retreat after partial wetting.

Gold Embrittlement in BGA Solder Joints

Gold embrittlement is a soldering defect that refers to solder joints that contain too much intermetallic compound (IMC), resulting in increased brittleness and reduced reliability.

Pin Device Desoldering Causes and Countermeasures

Desoldering refers to the reflow soldering process, one or more pins of the component can not be normal contact with the pad, resulting in incomplete or missing solder joints. Desoldering not only affects the performance and reliability of the circuit, but also increases the cost and difficulty of maintenance.

Grape Ball Effect Causes the Effective Life of Solder Paste after Printing

Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.