An overview of how solder paste cools down chips?

By optimising the thermal conductivity of the material, strengthening the metallurgical connection structure and adapting the alloy design to different application scenarios, solder paste achieves efficient heat dissipation of the chip.

Non-wetting and De-wetting during Soldering

Non-wetting and de-wetting phenomenon is a common defect in the welding process, they are respectively manifested as incomplete contact between solder and base metal and retreat after partial wetting.

Gold Embrittlement in BGA Solder Joints

Gold embrittlement is a soldering defect that refers to solder joints that contain too much intermetallic compound (IMC), resulting in increased brittleness and reduced reliability.

Pin Device Desoldering Causes and Countermeasures

Desoldering refers to the reflow soldering process, one or more pins of the component can not be normal contact with the pad, resulting in incomplete or missing solder joints. Desoldering not only affects the performance and reliability of the circuit, but also increases the cost and difficulty of maintenance.

Grape Ball Effect Causes the Effective Life of Solder Paste after Printing

Grape ball effect refers to the SMT reflow process, the paste can not be completely melted and wet pads, and the formation of a small ball similar to grapes, affecting the reliability and appearance of the solder joints.

How to estimate the amount of solder paste to print?

Estimating solder paste printing volume is a critical step in surface mount technology (SMT), directly impacting soldering quality and costs.

The Difference Between SPI and AOI in SMT

In surface mount technology (SMT) production processes, solder paste inspection (SPI) and automatic optical inspection (AOI) serve as two core quality control technologies. Through their distinct functions and collaborative efforts, they jointly establish an efficient quality assurance system.

What is the best way to manually apply solder paste?

Manual solder paste scraping is a critical step in hand soldering or rework during electronics manufacturing, requiring a balance of precision, efficiency, and safety. Below are detailed step optimization methods and precautions to help you achieve optimal results: