What is the difference between laser solder paste and regular solder paste?

The difference between laser solder paste and ordinary solder paste is mainly reflected in its composition, soldering mechanism, performance advantages and application areas, the following is a more detailed analysis:

Void Caused by the Inherent Characteristics of Solder Paste Flux

Under the same PCB and device conditions, some solderingmaterials are prone to void fommation, while some solder pastes exhibitexcellent properties for controlling solder joint void.

Mechanism of Intermetallic Compound Formation

Intermetallic compounds are a class of substances formed by chemical bonding of metallic elements in specific atomic proportions.

Explain the composition and characteristics of solder paste?

will continue to expand and improve.

Analysis of half-wetting phenomenon in the SMT process

to improve the solderability of the base metal, reduce the presence of contaminants and optimise the welding process parameters.At the same time, appropriate repair measures are required to ensure the quality and reliability of welded joints where half-wetting has already occurred.

What is the difference between a solder pad and an overbore?

the pads and holes in the PCB design and manufacturing each has its unique role and design requirements.Proper understanding and application of them is critical to ensure the performance and reliability of the circuit board.

How long after mixing will solder paste fail if it is not used?

Failure management after solder paste mixing is a key quality control aspect. The following is a detailed analysis and summary of failure management after solder paste mixing:

Analysing the effect of holes in discs and POFV holes

the design of the hole-in-disk and POFV holes has an important impact on the performance and reliability of the printed circuit board.Strict control of the process and quality standards is required during the manufacturing process to ensure that the design of these holes meets the requirements of actual applications and has good reliability and per