Common PCB solderability inspection methods

PCB solderability inspection method refers to the use of certain methods and standards to evaluate the solderability of the pads or components on the PCB, that is, the wettability and interfacial reactivity between the solder and the solder.

The Solder Joint Void Caused by Electroplating Impurity

Voids are usually observed during reflow soldering, which is generally considered to be one of the reasons for weakening the thermal conductivity and mechanical strength of solder joints. When analyzing the cause of void formation, we can easily associate it with flux.

Pad surface treatment in microelectronics and semiconductor packaging

In microelectronics and semiconductor packaging, the most basic purpose of pad surface treatment is to ensure good solderability and conductivity of the pads. Since copper tends to exist as oxide in air and is unlikely to remain as pristine copper for long, other treatments are required for copper.

How to Select the Right Anisotropic Conductive Adhesive for Your Product?

When selecting anisotropic conductive adhesives (ACA) suitable for specific products, Fitech leverages technological innovation and industry expertise to deliver high-performance solutions for ultra-fine pitch connections, flexible electronics packaging, and high-frequency signal transmission.

Recommended well-known brands of high-temperature solder

In the field of high-temperature soldering, the selection of solder directly impacts both soldering quality and equipment reliability. As industrial manufacturing evolves toward higher precision and greater temperature resistance, the demand for high-temperature solder continues to grow.

Introduction to Package on Package (PoP) and Pad Printing

With the development of semiconductor-integrated technology, the electronic products in the current market, such as mobile phones, computers, and electronic watches, are small and portable, with excellent electrical performance and low prices. The development of packaging technology is one of the key factors to improve performance and reduce the pr

The mechanical strength of high-temperature gold-germanium solder

When talking about lead-free solder, people often think of tin-bismuth solder, tin-silver-copper solder, and tin-antimony solder. These solders have a wide range of applications, covering different soldering temperatures, but are limited to melting temperatures below 300°C.

The Difference Between Anisotropic Conductive Adhesive and Isotropic Conductive Adhesive

Anisotropic conductive adhesives (ACA) and isotropic conductive adhesives (ICA) exhibit significant differences in terms of conductive direction, conductive particle concentration, application scenarios, preparation processes, and storage conditions.