Underfill Process on Flip Chips

Flip chip (FC) technology is a packaging method in which the chip is directly attached to the substrate, which has the advantages of high density, high performance and low cost.

Comparison of Surface Mount and Through-Hole Technologies

Surface mount technology (SMT) and through-hole insertion technology (THT) are the two main methods of mounting electronic components on printed circuit boards (PCBs).

Corrosion Effecs t of Salt Spray on SAC305 Solder

Electronic products are used in a variety of environments, which requires them to have good reliability in different environments.

Relationship between Laser Soldering Reflectivity and Solder

Fitech is committed to the R&D and sales of electronic-grade solder materials and can provide customers with ultra-fine solder paste and powder (T6 and above).

Shenzhen Fitech was invited to participate in 2024 Global CMOS Sensor Application Technology Summit

On April 17, 2024, Fitech was invited to participate in the Global CMOS Sensor Application Technology Summit. Thank you for your presence during this time!

Advantages of Solder Paste Containing Bismuth compared to SAC305 Solder Paste_Shenzhen Fitech

SAC305 alloy is considered an important metal component of lead-free solder due to its relatively high melting point. Solder joints prepared with SAC305 solder can maintain good condition when subjected to thermal cycles and mechanical stress, so they are of great use in many industries such as the automotive and aerospace industries.

Application of Gold-Tin Solder on Power LED Devices

With the continuous development of LED technology, the luminous efficacy and brightness of LEDs have been improved, especially in the field of solid-state lighting, the market demand for high-power LEDs continues to grow.

Tombstone Effect of Components_Shenzhen Fitech

Component "tombstone" phenomenon in the reflow soldering often occurs, refers to the chip components in the soldering process stand up the situation, also known as "drawbridge" or "Manhattan" phenomenon.