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Welcome to the Sz Fitech Solder News and Updates page.  Here you’ll find our latest news release, company announcements, and essential industry news that shapes the modern solder landscape.

Detailed explanation of the production process of solder paste

Detailed explanation of the production process of solder paste

The production process for solder paste is a complex process involving several steps designed to ensure the production of high-quality products for use in surface mount technology (SMT) in the electronics manufacturing industry. The following is a detailed production process:

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Detailed explanation of the standard specifications and applications of tin powder particles

Detailed explanation of the standard specifications and applications of tin powder particles

Tin powder has a wide range of uses and is commonly used as an additive and porous material in powder metallurgy. Tin powder is also used as a high purity reagent in the electronics industry. The particle standard of tin powder is generally reflected by the particle size distribution, particle size,

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How is solder paste made?

How is solder paste made?

The main materials that need to be prepared to make solder paste include tin powder and flux. Among them, tin powder is the main ingredient and flux is the auxiliary ingredient, and they can improve the soldering quality and workmanship.

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What is commonly used to clean flux residue preferably?

What is commonly used to clean flux residue preferably?

The method of cleaning flux residues and the choice of cleaning agent depends on the type of flux, and different fluxes require different cleaning methods.

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Storage and usage of solder paste

Storage and usage of solder paste

Solder paste (solder paste) is a commonly used material in the electronic assembly process, and its storage and use methods are critical to ensuring solder quality and performance. The following are the detailed storage and usage methods:

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Analysis of SAC305 solder paste and its function

Analysis of SAC305 solder paste and its function

SAC305 solder paste is a lead-free solder, specially developed to adapt to environmental protection requirements and meet the RoHS and REACH requirements of the European Union. It is mainly composed of tin-silver-copper alloy (containing 96.5% tin, 3% silver and 0.5% copper) and flux, the melting temperature of the alloy is 217 degrees Celsius, and

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PCBA Conformal Coating Process Corrosion Failure Analysis

PCBA Conformal Coating Process Corrosion Failure Analysis

Conformal coating, refers to the addition of a layer of protective coating to protect products and improve product reliability, three-proof paint plays a role in isolating electronic components and circuit boards from harsh environments.

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The Effect of Ag Content on the Reliability of SnBi Solder LED Package

The Effect of Ag Content on the Reliability of SnBi Solder LED Package

Light-emitting diodes (LEDs), as a new type of lighting and display technology with high efficiency, small size, long life and low power consumption, are widely used in a variety of fields such as household lighting, automotive indicator lights, avionics and display backlighting units, etc.

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