Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

What are the factors that affect solder paste activity?

Regularly test solder paste activity and avoid using expired or deteriorated solder paste.

SZ Fitech Invites You to SEMICON Southeast Asia 2025

As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025.

How to solve the problem of dry solder paste?

For solder paste drying problem, you can start from storage, use, process, environment, material selection, emergency treatment and other aspects, the following provides you with systematic solutions:

What are the Characteristics of Water-Soluble Solder Paste_Solder Paste Cleaning

The traditional solder flux is formulated with rosin or epoxy resin as the base material, mixing with an active agent, thixotropic agent, solvent, and other substances. At present, two major factions of no-clean solder paste and water-soluble solder paste have been derived based on flux compositions. No-clean solder paste, as the name suggests, pro

Factors Affecting Flux Spatter

There is a problem with solder and flux spatter during reflow soldering, which can have a significant impact on the quality and reliability of electronic products. The residue of flux on PCB not only has chemical corrosiveness, but also some residues have insulation properties, which can affect the circuit test results. Flux spatter is influenced b

What is SMT solder paste process and red glue process?

SMT solder paste process and red glue process are two key processes in electronic manufacturing, the main difference lies in the material characteristics, process purpose and applicable scenarios.The following is a detailed analysis:

How to make QFN solder climb height of 50% or more?

In order to make QFN soldering climb tin height of more than 50%, it is necessary to optimise the stencil design, solder paste selection, soldering environment control, pretreatment process in four aspects.The following are specific programmes and validation cases：