How to solve the problem of dry solder paste?

For solder paste drying problem, you can start from storage, use, process, environment, material selection, emergency treatment and other aspects, the following provides you with systematic solutions:

What are the Characteristics of Water-Soluble Solder Paste_Solder Paste Cleaning

The traditional solder flux is formulated with rosin or epoxy resin as the base material, mixing with an active agent, thixotropic agent, solvent, and other substances. At present, two major factions of no-clean solder paste and water-soluble solder paste have been derived based on flux compositions. No-clean solder paste, as the name suggests, pro

Factors Affecting Flux Spatter

There is a problem with solder and flux spatter during reflow soldering, which can have a significant impact on the quality and reliability of electronic products. The residue of flux on PCB not only has chemical corrosiveness, but also some residues have insulation properties, which can affect the circuit test results. Flux spatter is influenced b

What is SMT solder paste process and red glue process?

SMT solder paste process and red glue process are two key processes in electronic manufacturing, the main difference lies in the material characteristics, process purpose and applicable scenarios.The following is a detailed analysis:

How to make QFN solder climb height of 50% or more?

In order to make QFN soldering climb tin height of more than 50%, it is necessary to optimise the stencil design, solder paste selection, soldering environment control, pretreatment process in four aspects.The following are specific programmes and validation cases：

Detailed explanation of the solder paste process in the soldering defect phenomenon

In the solder paste process, soldering defect phenomenon is a common soldering defect that manifests itself as a solder joint that appears to be connected on the surface but actually has poor electrical contact or insufficient mechanical strength.

Detailed explanation of the solder paste process in the phenomenon of non-wetting

Through the synergistic optimisation of material, process and design, the non-wetting problem can be effectively controlled, thus improving the long-term reliability of solder joints.

What is the difference between solid crystal solder paste and conventional SMT solder paste?

If confused use (such as solid crystal with SMT solder paste), may lead to heat damage to the chip or bonding strength is insufficient; Conversely, solid crystal solder paste welding components may be due to poor wettability resulting in poor welding.