The principle of anisotropic conductive adhesive in detail

Anisotropic Conductive Adhesive (Anisotropic Conductive Adhesive, ACA) is a special kind of conductive adhesive, its conductivity has a directional, that is, after hot pressing and curing in one direction (usually vertical) with good conductivity, while in another direction (such as the horizontal direction) is manifested as insulation.

What is the difference between solid crystal solder paste and red glue?

Solid crystal solder paste and red glue are two common materials in the field of electronic packaging, and they have significant differences in composition, function, process, performance and application.

μBGA, CSP in the Reflow Soldering of the Reasons for the High Rate of Cold Soldering

In the reflow soldering process, for μBGA and CSP packaged chips with dense feet (pitch ≤ 0.5mm), there is a risk of higher incidence of cold soldering due to the hidden nature of the soldering site and the difficulty of heat transfer to the solder ball solder joint site. Under the same peak temperature and reflow time conditions, the heat gain

Printing Solder Paste_ Electroforming Process for Stencil Manufacturing

Shenzhen Fitech can provide solder paste products for the printing process. Fitech’s printing solder paste has adjustable viscosity, guaranteeing excellent printability and solder release performance. The products can help customers eliminate their concerns about the unstable printing performance of solder paste. Welcome to inquire for more infor

The Introduction of IoT

When you start your day, the alarm goes off, and the coffee maker starts brewing. The lights come on as you walk through the house. Some invisible computing device responds to your voice commands, reads your schedule and news, and turns on TV news when you're ready. Your car will drive you to work through the least congested routes, allowing you to

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect

What are the factors that affect solder paste activity?

Regularly test solder paste activity and avoid using expired or deteriorated solder paste.

SZ Fitech Invites You to SEMICON Southeast Asia 2025

As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibition Centre from May 20–22, 2025.