What causes a lot of solder paste residue?

The problem of solder paste residue is usually caused by a combination of process parameters, material properties, equipment condition and environmental control.The following combines industry practice and the latest research, common causes and solutions for systematic sorting and supplement:

What are the brands of solder paste widely used in China at present?

The widely used solder paste brands in China include both internationally renowned brands and excellent local manufacturers.

How to clean the solder paste left in the solder paste bottle?

that combines physical and chemical methods and safe practices to ensure efficient, safe and environmentally friendly cleaning:

The physical characteristics and application areas of tin powder

As an important metal powder material, tin powder, by virtue of its unique physicochemical properties, shows a wide range of application value in a number of industrial fields.The following is a detailed description from both physical characteristics and application areas:

Detailed explanation of the causes of non-wetting open soldering and improvement measures

Non Wet Open (NWO) refers to the PCB (Printed Circuit Board), BGA (Ball Grid Array) pads do not achieve a good wet open solder joints.Typical characteristics of its slicing diagram for all or part of the PCB pads on the lack of solder wetting, as shown in Figure 1-1 (not attached here, but a clear description).

What is the best solder paste to choose for AI chip packaging?

In AI chip packaging, the selection of suitable solder paste needs to take into account the chip power density, packaging process, reliability requirements and thermal performance.

What Is Black Pad?

Copper is commonly used as the pad material in the packaging process. To avoid copper oxidation and improve the solderability of copper pads, various surface treatment methods are used to coat metal layers on copper pads. Common surface treatment processes include OSP, electroless nickel immersion gold (ENIG), etc.

Wave Soldering Solder Pull Tip is How to Form

Wave soldering, sometimes found at the top of the components and pins or solder joints with icicle or stalactite-like solder, this phenomenon is called pull tip, as shown in Figure.