What is Kirkendall Hollow

Is the export of solder paste regulated?

Solder paste exports are not all controlled, but companies need to assess the risk based on product composition, use and target market dynamics.It is recommended to establish a compliance system, including composition testing, licence application, declaration specifications, etc., in order to avoid legal risks.

Dynamic thermal deformation curves for commonly used BGA packages

Analysis of P-BGA and F-BGA thermal deformation process and stencil opening optimisation

In-depth analysis of solder paste viscosity standards

Solder paste viscosity standards need to be combined with specific application scenarios, test methods and industry standards to make a comprehensive judgement.By accurately controlling the viscosity and thixotropic properties, SMT process yields can be significantly improved, and printing defects and soldering problems can be avoided.

What are the requirements for solder paste in the aerospace sector?

The technical requirements for solder pastes in the aerospace sector reflect the deep integration of cutting-edge materials science and engineering practice.The following is a systematic overview of the technical challenges, solutions and industry trends:

What solder paste do I need to solder a mobile phone motherboard?

Soldering mobile phone motherboards requires the selection of solder paste suitable for high-density, fine solder joints, and the following are key factors and recommendations:

Reliability of BGA solder joints under mechanical and thermal stresses

BGA (Ball Grid Array Package) is a common integrated circuit packaging technology which has the advantages of large contact area and high signal transmission efficiency. However, BGA solder joints are located at the bottom of the device and are not easy to detect and maintain.

Device failure due to SMT wick effect

The wick effect, also known as the creeping tin effect, is an inherent characteristic of solder in the PCB soldering mechanism: "solder always flows from low temperature to high temperature", which means that the nature of solder is to go where the temperature is high.