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Welcome to the Sz Fitech Solder News and Updates page.  Here you’ll find our latest news release, company announcements, and essential industry news that shapes the modern solder landscape.

In-depth analysis of solder paste viscosity standards

In-depth analysis of solder paste viscosity standards

Solder paste viscosity standards need to be combined with specific application scenarios, test methods and industry standards to make a comprehensive judgement.By accurately controlling the viscosity and thixotropic properties, SMT process yields can be significantly improved, and printing defects and soldering problems can be avoided.

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What are the requirements for solder paste in the aerospace sector?

What are the requirements for solder paste in the aerospace sector?

The technical requirements for solder pastes in the aerospace sector reflect the deep integration of cutting-edge materials science and engineering practice.The following is a systematic overview of the technical challenges, solutions and industry trends:

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What solder paste do I need to solder a mobile phone motherboard?

What solder paste do I need to solder a mobile phone motherboard?

Soldering mobile phone motherboards requires the selection of solder paste suitable for high-density, fine solder joints, and the following are key factors and recommendations:

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Reliability of BGA solder joints under mechanical and thermal stresses

Reliability of BGA solder joints under mechanical and thermal stresses

BGA (Ball Grid Array Package) is a common integrated circuit packaging technology which has the advantages of large contact area and high signal transmission efficiency. However, BGA solder joints are located at the bottom of the device and are not easy to detect and maintain.

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Device failure due to SMT wick effect

Device failure due to SMT wick effect

The wick effect, also known as the creeping tin effect, is an inherent characteristic of solder in the PCB soldering mechanism: "solder always flows from low temperature to high temperature", which means that the nature of solder is to go where the temperature is high.

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What causes a lot of solder paste residue?

What causes a lot of solder paste residue?

The problem of solder paste residue is usually caused by a combination of process parameters, material properties, equipment condition and environmental control.The following combines industry practice and the latest research, common causes and solutions for systematic sorting and supplement:

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What are the brands of solder paste widely used in China at present?

What are the brands of solder paste widely used in China at present?

The widely used solder paste brands in China include both internationally renowned brands and excellent local manufacturers.

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How to clean the solder paste left in the solder paste bottle?

How to clean the solder paste left in the solder paste bottle?

that combines physical and chemical methods and safe practices to ensure efficient, safe and environmentally friendly cleaning:

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