Detailed explanation of the solder paste process in the dropped pieces and solder ball problem

In the electronic assembly process, dropped parts and solder balls are common quality problems, they have a direct impact on the reliability and performance of the product.

Analysis of the causes and hazards of tin bead defects

Tin beads are formed during the soldering process, when there are solder paste printing defects, solder paste collapses or is pressed out of the pad by the SMD device, after re-flow, in the side of the component or stay under the component to form a tin bead. It is similar to the solder ball, but the size is very large, usually in the huge chip com

Is leaded or lead-free solder paste better?

The choice of solder paste, the comparison between leaded and lead-free solder paste, depends on a number of factors such as specific application scenarios, environmental requirements, cost considerations and soldering results. The following is a detailed analysis of the advantages and disadvantages of the two and the process and so on

How to set the conditions for acceptable solder paste printing graphics?

Fine-pitch components (e.g. QFN, BGA, etc.) have extremely high requirements for solder paste uniformity, thickness and edge definition due to their small pin spacing. Any minor printing defects can lead to poor soldering, such as bridging, open circuits or empty soldering. Therefore, these special requirements must be fully taken into account when

Under-tin and under-printing in the SMT process

The phenomena of less tin and missed prints in the SMT (Surface Mount Technology) process are common quality problems, and they have an important impact on the quality and reliability of products. The following is a detailed analysis of these two phenomena

Furnace Temperature Profile Design and Solutions

Furnace temperature profile design is a complex and critical process, which directly affects product quality and production efficiency. In the design of the temperature curve, the following aspects need to be noted:

Analysis of the advantages and disadvantages of OSP and application issues

OSP (Organic Solder Protective Sheet) as a surface treatment technology has shown significant advantages in electronics manufacturing, especially in fine pitch devices and applications with high coplanarity requirements, but also comes with some challenges and considerations. The following is a detailed analysis of OSP applications, advantages, sho

What are the factors that affect the reliability of lead-free solder joints?

Lead-free soldering does present some solder joint reliability challenges relative to traditional lead (Pb) containing processes. This stems mainly from the differences between Pb-free brazing materials and traditional brazing materials, as well as the adjustment of process parameters. So what are the specific factors that affect the reliability of