How to improve solder paste printing yield?

In summary, to improve the yield of solder paste printing needs to consider the quality of solder paste, equipment and process optimisation, stencil and paste characteristics matching, environmental control, process monitoring and testing, as well as continuous improvement and innovation and other aspects.Through the implementation of these strateg

The phenomenon of tin not soldering onto the pad of a desoldered PCB.

Through the optimisation of tin sinking process, improve the solderability of the base metal, eliminate impurities and outgassing sources, the use of appropriate reflow gas and temperature profile and strengthen the quality control and process monitoring and other measures, can effectively solve the double-sided mounting PCBA in the second solderin

Explain the principle and advantages of laser solder paste

Summary: laser solder paste technology with its high precision, high efficiency, non-contact welding, environmental protection and safety, local heating, rapid heating and cooling, flexible heating specifications, precise temperature control, a wide range of applications and reduce costs and other advantages in the field of electronic manufacturing

How the price of solder paste is calculated

The price of solder paste is calculated in a variety of ways, and the exact price is affected by a number of factors.When choosing solder paste, in addition to considering the price factor, you also need to pay attention to the brand, model, composition, quality grade of the solder paste, as well as the supplier's reputation and service and other f

What is wafer microbumping packaging?

Wafer microbumping packaging, more commonly expressed as Wafer Microbumping or Wafer Bumping, is an advanced semiconductor packaging technology.The following is a detailed explanation of Wafer Bumping:

Principle and application method of conductive adhesive

Conductive adhesive, an adhesive that exhibits specific conductive properties after curing or drying, its unique conductive properties and a wide range of application scenarios make it an important and indispensable material in the electronics industry.

The method of preparing fine solder powder (ultra-micro solder powder)

There are various ways to prepare fine solder powder, and five commonly used methods are described below

Analysis of QFN package bridging phenomenon and suggestions for improvement

the causes of QFN package bridging phenomenon mainly include solder extrusion, QFN deformation, and the correspondence between void ratio and bridging.To address these issues, we can reduce the amount of solder paste printed on the inner ring and provide tin space to improve the two aspects.Through reasonable process design and optimisation, we can