High-Temperature Leaded Solder Paste

The high-quality FTD-925 dispensing solder paste is produced by mixing SnPbAg solder powder with excellent sphericity, uniform particle size, and low oxygen content with outstanding halogen-free flux. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-collapse and less residual performance.FTD-925 is suitable for micro-bump ultra-fine-pitch soldering.

1. Adapting solder powder formulation with high sphericity and narrow particle size distribution, which contributes tostable solder paste discharge and anti-collapse performance;
2. It has outstanding chemical activity, satellite solder ball elimination performance, and excellent wettability;

3. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used;

4. Good thixotropy, proper viscosity, superior stability, no stratification, and long working life.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

The high-quality FTD-950 dispensing solder paste is produced by mixing SnPb solder powder with excellent sphericity, uniform particle size, and low oxygen content with outstanding halogen-free flux. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-collapse and less residual performance. FTD-950 is suitable for micro-bump ultra-fine-pitch soldering.

1. Adapting solder powder formulation with high sphericity and narrow particle size distribution, which contributes to stable solder paste release and anti-slump performance;

2. It has outstanding chemical activity, satellite solder ball elimination performance, and excellent wettability;

3. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used;

4. Good thixotropy, proper viscosity, superior stability, no stratification, and long working life.

Recovery method: Don't open the bottle cap until the solder is close to room temperature. No more than two times of temperature return.

Recovery time: Generally, paste should be removed from refrigeration 2~3 hours before use. Actual time to reach thermal equilibrium will vary with container size.

Note: Do not open the bottle cap without sufficient "recovery" or shorten the recovery time by heating the paste.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.