The No-Clean Flux

Fine-pitch flux assists in the manufacturing, assembly, and packaging of microelectronics and semiconductors. It is suitable for high precision and reliability packaging of wafer bumping soldering, chip evaporation soldering, BGA, SiP, CSP, Micro LED packaging, module integrated circuits, etc. Fitech's zero-halogen epoxy flux has self-assembly and self-correction functions. Epoxy curing after soldering provides excellent insulation, corrosion resistance, and reliability performance, and it is compatible with underfill and bonding. It can be used in the printing or dispensing process.

The no-clean flux is a popular type of flux that is used to assist soldering, which is mainly used in the electronic manufacturing industry, especially in the production of microelectronics and semiconductors.